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High thermal conductivity (≥1.5 W/m·K) for efficient heat dissipation in power electronics.
Excellent electrical insulation properties with volume resistivity >1×10¹⁴ Ω·cm.
Low modulus and high elasticity enable stress relief and long-term reliability under thermal cycling.
Platinum-catalyzed addition cure system ensures precise stoichiometric mixing and minimal by-products.
UL 94 V-0 rated flame retardancy without halogen additives, meeting stringent safety standards.
Thermal interface material (TIM) for IGBT modules and power semiconductor packages.
Encapsulation and potting of automotive EV inverters and on-board chargers.
Gap-filling pads and dispensable thermal gels in server power supplies and 5G base station equipment.
Die-attach and underfill applications in high-power LED assemblies.
Thermally conductive bonding layers for battery management systems (BMS) and energy storage units.
| Chemical Type | Platinum-catalyzed addition-curing silicone rubber |
| Product Form | Two-component liquid system (Part A: base; Part B: catalyst) |
| Appearance | Part A: translucent gray liquid; Part B: translucent gray liquid |
| Mixing Ratio (A:B) | 1:1 by weight |
| Cure Temperature Range | 25–150 °C (room temperature cure possible with extended time) |
| Shore A Hardness (7 days @ 23°C) | 55 ± 5 |
| Thermal Conductivity | 1.5 W/m·K (ASTM D5470) |
| Density | 2.0 g/cm³ (ISO 1183) |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
