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High thermal conductivity (1.5 W/m·K) for efficient heat dissipation in electronic assemblies.
Excellent electrical insulation properties combined with low compression set after prolonged thermal cycling.
Platinum-catalyzed, addition-cure chemistry enabling precise control over pot life and cure speed.
Low viscosity before curing ensures excellent flow and gap-filling capability in complex geometries.
UL 94 V-0 rated after full cure, supporting compliance in safety-critical applications.
Thermal interface material (TIM) for power electronics, including IGBT modules and EV inverters.
Encapsulation and potting of high-power LED drivers and automotive control units.
Gap-filling adhesive for battery module thermal management systems.
Die-attach and underfill solutions in semiconductor packaging requiring stable thermal performance.
Thermally conductive gasketing for server and data center cooling assemblies.
| Chemical Type | Platinum-catalyzed addition-cure silicone rubber |
| Product Form | Two-component liquid system (Part A + Part B) |
| Appearance | Opaque gray paste (Part A), translucent gray paste (Part B) |
| Primary Applications | Thermal interface materials, encapsulation, gap filling |
| Key Features | High thermal conductivity, low compression set, flame retardant |
| Benefits | Enhanced reliability under thermal cycling, no by-products during cure, excellent adhesion to metals and plastics |
| Cure Temperature Range | Room temperature to 150 °C (accelerated cure at elevated temperatures) |
| Shelf Life (unopened, 25 °C) | 12 months for Part A; 9 months for Part B |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
