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Ultra-low modulus silicone gel formulation for minimal mechanical stress on sensitive electronic components.
Excellent thermal conductivity (1.5 W/m·K) enabling efficient heat dissipation in power electronics.
Self-adhesive without primer — bonds reliably to plastics, metals, and PCB substrates.
UL 94 V-0 rated for flame retardancy, meeting stringent safety requirements in enclosed assemblies.
Long-term stability under thermal cycling (-40 °C to +150 °C) with no pump-out or cracking.
Thermal interface material (TIM) between IGBT modules and heat sinks in inverters and EV powertrains.
Underfill and stress-relief encapsulation for high-power LED packages and driver circuits.
Die-attach and gap-filling in automotive ADAS radar and sensor housings.
Thermal management layer in renewable energy converters (solar inverters, wind turbine controllers).
| Chemical Type | Platinum-cured addition-cure silicone gel |
| Product Form | Two-component liquid (Part A + Part B), mix ratio 1:1 by weight |
| Appearance | Translucent, low-viscosity paste |
| Primary Applications | Thermal interface material (TIM), stress-relief encapsulation, die attach |
| Key Features | Low modulus, self-adhesive, flame-retardant (UL 94 V-0), reworkable |
| Shore A Hardness (cured) | 5–10 |
| Thermal Conductivity | 1.5 W/m·K |
| Operating Temperature Range | -40 °C to +150 °C (continuous) |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
