English
Español
tiếng việt
русский
One-component, platinum-catalyzed addition-cure silicone gel with no by-products during curing.
Ultra-low modulus and exceptional conformability for stress-free encapsulation of delicate electronic components.
Excellent thermal stability, operating continuously from –50 °C to +200 °C.
Outstanding electrical insulation properties and low dielectric constant (≈2.7 at 1 MHz).
Non-tacky surface after cure, enabling easy handling and compatibility with automated dispensing systems.
Underfill and protective coating for power electronics modules (e.g., IGBTs, SiC MOSFETs).
Encapsulation of sensitive sensors, MEMS devices, and LED assemblies.
Thermal interface material (TIM) in high-reliability automotive and industrial control units.
Conformal protection for PCBs exposed to thermal cycling, vibration, or humidity.
Die attach and stress-relief padding in optoelectronic packaging and hybrid circuits.
| Chemical Type | Platinum-catalyzed addition-cure silicone gel |
| Product Form | Paste (thixotropic, pumpable) |
| Appearance | Opaque white to off-white viscous paste |
| Primary Applications | Electronic encapsulation, thermal management, stress relief |
| Key Features | 1K system, room-temperature or accelerated heat cure, non-corrosive |
| Shore A Hardness (7 days, 23 °C) | ≤0.2 |
| Density (23 °C) | 1.15 g/cm³ |
| Viscosity (25 °C, Brookfield LVT, Spindle #4, 12 rpm) | 450,000 mPa·s |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
