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Ultra-low modulus silicone gel offering exceptional stress relief for sensitive electronic components.
Self-adhesive without requiring primers—bonds reliably to plastics, metals, and coated PCBs.
Excellent thermal stability with continuous service temperature range from −50 °C to +200 °C.
UL 94 V-0 rated for flame resistance, supporting compliance in safety-critical applications.
Non-corrosive and halogen-free formulation, suitable for RoHS- and REACH-compliant manufacturing.
Underfill and encapsulation of power semiconductor modules (e.g., IGBTs, SiC MOSFETs).
Thermal interface material (TIM) for LED drivers and automotive lighting assemblies.
Protection of MEMS sensors and high-precision analog circuitry against mechanical shock and vibration.
Conformal coating alternative for high-voltage battery management systems (BMS) in EVs.
| Chemical Type | Platinum-cured addition-cure silicone gel |
| Product Form | Paste (thixotropic, two-component) |
| Appearance | Translucent gray gel |
| Primary Applications | Electronics encapsulation, thermal management, mechanical stress relief |
| Key Features | Low modulus, self-adhesive, flame-retardant, non-corrosive |
| Shore A Hardness (7 days, 23 °C) | 10–15 |
| Density (23 °C) | 1.25 g/cm³ |
| UL Recognition | UL 94 V-0, UL 746C (RTI: 130 °C electrical, 150 °C mechanical) |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
