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One-component, platinum-catalyzed addition-cure silicone gel with ultra-low modulus for exceptional stress relief.
Self-adhesive to common substrates including plastics, metals, and PCBs without primer.
Excellent thermal stability from –60 °C to +200 °C with long-term aging resistance.
Low viscosity before cure enables easy dispensing, needle dispensing, and conformal coverage of complex geometries.
UL 94 V-0 rated for flame retardancy and compliant with RoHS and REACH regulations.
Underfill and stress-relief encapsulation for power electronics and IGBT modules.
Thermal interface material (TIM) between heat sinks and high-power semiconductor devices.
Protection of sensitive SMD components, sensors, and LED assemblies against mechanical shock and vibration.
Conformal coating for automotive ECUs, battery management systems (BMS), and ADAS control units.
Die attach and cavity fill in optoelectronics and medical device packaging.
| Chemical Type | Platinum-catalyzed addition-cure silicone gel |
| Product Form | Paste (thixotropic, non-sag) |
| Appearance | Translucent, off-white to light amber gel |
| Primary Applications | Stress relief, underfill, thermal management, conformal protection |
| Key Features | 1K system, self-adhesive, low modulus, flame-retardant |
| Shore A Hardness (7 days, 23 °C) | 10–15 |
| Density (23 °C) | 1.15–1.20 g/cm³ |
| Storage Stability (unopened, 25 °C) | ≥6 months |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
