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Two-component, addition-cure silicone gel system offering excellent thermal stability and low compression set.
Ultra-low viscosity before curing enables deep penetration and void-free encapsulation of sensitive electronic components.
Self-healing surface properties provide long-term protection against moisture ingress and environmental contaminants.
UL 94 V-0 rated after full cure, supporting compliance with stringent electrical safety standards.
Non-corrosive formulation compatible with copper, silver, and standard PCB substrates without outgassing concerns.
Encapsulation and potting of high-voltage power modules and IGBTs in electric vehicle inverters.
Protection of LED driver electronics in outdoor lighting systems exposed to thermal cycling and humidity.
Conformal coating replacement for aerospace-grade avionics where vibration damping and dielectric integrity are critical.
Thermal interface material (TIM) support layer in hybrid power packages requiring stress relief and CTE matching.
Insulation and mechanical stabilization of MEMS sensors in industrial automation and automotive ADAS modules.
| Chemical Type | Platinum-catalyzed addition-cure silicone elastomer |
| Product Form | Two-part liquid system (Part A: base; Part B: catalyst) |
| Appearance (Uncured) | Transparent, low-viscosity liquids (Part A & B separately) |
| Mixing Ratio (A:B by weight) | 10:1 |
| Cure Temperature Range | 25–125 °C |
| Full Cure Time (at 100 °C) | 2 hours |
| Density (25 °C, cured) | 1.12 g/cm³ |
| Dielectric Strength (cured) | ≥20 kV/mm |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
