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Two-component, platinum-catalyzed addition-cure silicone gel system offering excellent low-stress encapsulation.
Ultra-low modulus and high elasticity provide superior mechanical shock absorption and stress relief for sensitive electronic components.
Excellent thermal stability with continuous service temperature range from –60 °C to +200 °C.
Low viscosity before curing enables deep penetration and void-free filling of complex geometries.
UL 94 V-0 rated (after full cure), supporting compliance in demanding safety-critical applications.
Encapsulation and protection of LED modules and drivers in lighting systems.
Stress-relieving potting of automotive sensors, ECUs, and power electronics.
Dielectric insulation and vibration damping for medical device circuitry and implantable electronics housings.
Conformal coating and underfill for high-reliability aerospace and defense electronics.
Protection of photovoltaic junction boxes and inverters exposed to outdoor thermal cycling.
| Chemical Type | Platinum-catalyzed addition-cure silicone elastomer |
| Product Form | Two-component liquid system (Part A: base; Part B: catalyst) |
| Appearance | Clear, low-viscosity liquids (Part A: colorless; Part B: pale yellow) |
| Mixing Ratio (A:B) by Weight | 10:1 |
| Cure Time (25 °C) | Approx. 24 h (full cure); surface tack-free in ~4–6 h |
| Shore A Hardness (7 days, 23 °C) | 10–12 |
| Density (23 °C) | ~0.98 g/cm³ |
| Dielectric Strength (ASTM D149) | ≥20 kV/mm |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
