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Two-component, addition-cure silicone gel system offering low modulus and high elasticity after curing.
Excellent thermal stability with continuous service temperature range from −50 °C to +200 °C.
Ultra-low viscosity in uncured state, enabling easy dispensing and deep encapsulation of sensitive electronic components.
Halogen-free formulation compliant with RoHS and REACH regulations.
Self-adhesive to common substrates (e.g., PCBs, plastics, metals) without primer requirement.
Encapsulation and protection of LED modules and power electronics.
Conformal coating for automotive control units exposed to vibration and thermal cycling.
Stress-relieving potting compound for MEMS sensors and precision measurement devices.
Dielectric isolation layer in high-voltage battery management systems (BMS).
Thermal interface material (TIM) for heat-sensitive optoelectronic assemblies.
| Chemical Type | Platinum-catalyzed addition-cure silicone gel |
| Product Form | Two-component liquid (Part A: base, Part B: catalyst) |
| Appearance (Uncured) | Transparent, low-viscosity liquids |
| Mixing Ratio (A:B) | 10:1 by weight |
| Cure Conditions | 1 h at 100 °C or 24 h at 23 °C (ambient humidity independent) |
| Hardness (Shore 00) | 10–15 (ASTM D2240) |
| Density (23 °C) | Approx. 1.08 g/cm³ |
| UL Recognition | UL 94 V-0 (cured) |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
