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Two-component, platinum-catalyzed addition-cure silicone gel system with ultra-low modulus and excellent conformability.
Self-adhesive to common substrates including plastics, metals, and printed circuit boards without primer.
Outstanding thermal stability and long-term reliability across -55 °C to +200 °C operating range.
Low viscosity before curing enables easy dispensing, potting, and gap-filling in complex geometries.
Electrically insulating with low dielectric constant and high volume resistivity for sensitive electronic applications.
Underfill and stress-relief encapsulation for surface-mount devices (SMD) and flip-chip assemblies.
Protection of LED modules, sensors, and flexible printed circuits (FPCs) against mechanical shock and vibration.
Conformal coating and potting for automotive electronics, including ECUs and ADAS components.
Thermal interface material (TIM) alternative for low-stress heat dissipation in power electronics.
Encapsulation of medical device electronics requiring biocompatibility and soft tactile response.
| Chemical Type | Platinum-catalyzed addition-cure silicone gel |
| Product Form | Two-component liquid system (Part A + Part B) |
| Appearance (Uncured) | Clear, low-viscosity liquids (Part A: colorless; Part B: pale yellow) |
| Mix Ratio (A:B by weight) | 1:1 |
| Cure Conditions | At room temperature (23 °C) or accelerated at 60–80 °C |
| Shore A Hardness (Cured) | 5–10 |
| Density (23 °C) | Approx. 1.05 g/cm³ |
| Dielectric Strength | ≥20 kV/mm |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
