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Platinum-catalyzed, two-component addition-cure silicone gel system with excellent long-term stability.
Ultra-low modulus and high elasticity enable exceptional stress relief for sensitive electronic components.
Outstanding thermal stability from –60 °C to +200 °C after full cure.
Electrically insulating with low dielectric constant and minimal outgassing (ASTM E595 compliant).
Self-adhesive to common substrates including plastics, metals, and cured silicones—no primer required.
Encapsulation and protection of LED modules and power electronics.
Conformal coating and underfill for PCB assemblies in automotive and industrial control units.
Thermal interface material (TIM) for heat-sensitive sensors and optoelectronic devices.
Vibration-damping cushioning in medical diagnostic equipment and wearable electronics.
Sealing and potting of high-reliability aerospace connectors and avionics housings.
| Chemical Type | Platinum-catalyzed addition-cure silicone gel |
| Product Form | Two-component liquid system (Part A + Part B) |
| Appearance (Uncured) | Translucent, low-viscosity liquids |
| Mix Ratio (A:B by weight) | 1:1 |
| Cure Conditions | RT cure (7 days) or accelerated cure (e.g., 2 h at 80 °C) |
| Hardness (Shore 00, ASTM D2240) | 10–15 |
| Density (g/cm³, ISO 1183) | 1.05–1.10 |
| Primary Applications | Electronic encapsulation, thermal management, vibration damping |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
