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Platinum-catalyzed, two-component addition-cure silicone gel system with excellent biocompatibility.
Ultra-low modulus and high conformability for stress-free encapsulation of sensitive electronic components.
Outstanding thermal stability across a wide operating temperature range (–60 °C to +200 °C).
Low viscosity before curing enables easy dispensing, potting, and self-leveling without air entrapment.
Non-tacky, non-skinning surface after cure — ideal for applications requiring clean handling and long-term reliability.
Encapsulation and protection of medical sensors and implantable electronics.
Conformal coating for automotive ADAS modules and power electronics.
Thermal interface material (TIM) for LED lighting assemblies and power semiconductors.
Potting compound for high-reliability aerospace and avionics control units.
Soft encapsulation of flexible printed circuits (FPCs) and wearable device components.
| Chemical Type | Platinum-catalyzed addition-cure silicone gel |
| Product Form | Two-component liquid system (Part A + Part B) |
| Appearance (Uncured) | Clear, low-viscosity liquids (Part A: colorless; Part B: faint yellow) |
| Shore A Hardness (Cured) | 5–10 (7 days @ 23 °C / 50 % RH) |
| Density (23 °C) | Approx. 1.10 g/cm³ (mixture) |
| Mixing Ratio (A:B by weight) | 1:1 |
| Curing Mechanism | Addition reaction (no by-products) |
| Primary Applications | Medical electronics, automotive sensors, LED thermal management, aerospace electronics |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
