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Two-component, platinum-catalyzed addition-cure silicone gel system with low viscosity for excellent flow and air release.
Ultra-low modulus and high elasticity enable exceptional shock absorption and stress relief in sensitive electronic assemblies.
Excellent thermal stability and long-term reliability across operating temperatures from –60 °C to +200 °C.
Low surface energy and non-tacky cured surface minimize dust adhesion and facilitate handling in cleanroom environments.
Biocompatibility tested per ISO 10993–5 (cytotoxicity) and USP Class VI compliant for medical device encapsulation.
Encapsulation and protection of LED modules and optical sensors in automotive lighting systems.
Underfill and stress-relief gel for flexible printed circuits (FPCs) and wearable electronics.
Dielectric insulation and vibration damping for high-voltage battery management systems (BMS).
Medical device potting for implantable and external diagnostic equipment requiring soft, compliant interfaces.
Optical bonding and light-guide coupling in display backlight units and touch-sensitive control panels.
| Chemical Type | Platinum-catalyzed addition-cure silicone elastomer |
| Product Form | Two-component liquid system (Part A and Part B) |
| Appearance (Uncured) | Transparent, low-viscosity liquids |
| Mixing Ratio (A:B by weight) | 1:1 |
| Cure Mechanism | Room temperature or elevated temperature addition cure |
| Shore A Hardness (Cured) | 5–10 |
| Density (g/cm³, 23 °C) | Approx. 1.10 |
| Primary Applications | Electronic encapsulation, medical device assembly, optical bonding |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
