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Ultra-soft, low-modulus silicone gel with Shore 00 hardness of ~10–15 for exceptional conformability and stress relief.
Two-component, platinum-catalyzed addition-cure system enabling precise mixing ratio (1:1 by weight) and consistent reproducibility.
Excellent thermal stability with continuous service temperature range from –60 °C to +200 °C.
Outstanding electrical insulation properties and dielectric strength (>20 kV/mm).
Low volatile organic compound (VOC) emission and compliance with ISO 10993-5 for cytotoxicity testing.
Encapsulation and potting of sensitive electronic components including sensors, LEDs, and PCBs.
Medical device cushioning and protective padding in wearable diagnostics and transdermal interfaces.
Thermal interface materials (TIMs) for heat-sensitive power electronics and battery modules.
Soft-touch overmolding and tactile feedback elements in human-machine interface (HMI) assemblies.
| Chemical Type | Platinum-catalyzed addition-cure silicone gel |
| Product Form | Two-component liquid system (Part A & Part B) |
| Appearance | Transparent, viscous liquids (Part A: colorless; Part B: pale yellow) |
| Mixing Ratio (A:B) | 1:1 by weight |
| Cure Mechanism | Room-temperature or accelerated heat cure (e.g., 60 °C for 2–4 h) |
| Shore 00 Hardness (ASTM D2240) | 10–15 (after full cure) |
| Density (g/cm³, 23 °C) | 1.08–1.12 |
| Dielectric Strength (kV/mm) | >20 (per ASTM D149) |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
