Fast-reacting aliphatic amine-based curing agent for room-temperature and elevated-temperature epoxy systems.
Enables excellent mechanical properties including high hardness, impact resistance, and chemical resistance in cured epoxy networks.
Low viscosity ensures easy handling, good mixing with epoxy resins, and superior wetting of fillers and reinforcements.
Low volatility and reduced skin sensitization potential compared to conventional aliphatic amines — supports safer industrial handling.
Compatible with standard bisphenol-A and bisphenol-F epoxy resins, enabling flexible formulation design.
High-performance industrial flooring and concrete repair mortars.
Structural adhesives for automotive and wind energy composite bonding.
Electrical encapsulation and potting compounds requiring fast throughput and reliable dielectric performance.
Coating systems for corrosion protection in marine and infrastructure environments.
Pultrusion and filament winding resins for fiber-reinforced polymer (FRP) profiles.
| Chemical Type | Aliphatic polyamine adduct |
| Product Form | Liquid |
| Appearance | Clear, pale yellow to amber liquid |
| Viscosity (25 °C) | Approx. 200–400 mPa·s |
| Density (20 °C) | Approx. 0.92–0.96 g/cm³ |
| Amine Value | 280–320 mg KOH/g |
| Primary Applications | Epoxy resin curing for coatings, adhesives, composites and mortars |
| Key Features | Room-temperature cure capability, low odor, improved safety profile |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China