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Low-viscosity polyamide curing agent enabling excellent flow and wetting of substrates.
Designed for ambient-cure epoxy systems with balanced pot life and rapid development of handling strength.
Provides outstanding adhesion to steel, concrete, and composite surfaces without primer.
Offers good chemical resistance, particularly to water, alkalis, and mild solvents.
Complies with REACH and is registered under the U.S. TSCA Inventory.
Structural bonding adhesives for transportation and industrial assembly.
High-performance epoxy mortars and grouts for concrete repair and anchoring.
Protective coatings for marine and offshore infrastructure.
Electrical encapsulation and potting compounds requiring low exotherm and dimensional stability.
| Chemical Type | Polyamide adduct |
| Product Form | Liquid |
| Appearance | Pale yellow to amber, clear to slightly hazy |
| Primary Applications | Ambient-cure structural adhesives, mortars, protective coatings |
| Key Features | Low viscosity, good substrate wetting, ambient cure capability |
| Benefits | Extended working time, rapid green strength build, no primer required on metals/concrete |
| Storage Stability | 12 months in original unopened container at 15–25°C |
Q1: What is the primary function of Aradur 3776 XW55 in epoxy systems?
A: Aradur 3776 XW55 is a polyamide-based curing agent designed to react with epoxy resins, enabling crosslinking at ambient or slightly elevated temperatures. It delivers balanced pot life, cure speed, and final film properties such as flexibility, adhesion, and chemical resistance—particularly suited for protective coatings and industrial maintenance applications.
Q2: Is Aradur 3776 XW55 compatible with standard liquid bisphenol-A epoxy resins?
A: Yes, it demonstrates good compatibility with common liquid DGEBA-type epoxy resins. It also performs well with modified epoxies, including those with reactive diluents or flexibilizers—though optimal formulation requires empirical adjustment based on resin functionality, molecular weight, and desired performance profile.
Q3: How does humidity affect the curing performance of this polyamide hardener?
A: As a polyamide-based system, Aradur 3776 XW55 exhibits relatively low sensitivity to ambient moisture compared to amine-catalyzed or anhydride-cured systems. However, prolonged exposure to high humidity during cure may influence surface dryness and gloss development—especially in thick-film applications—so controlled application conditions are recommended.
Q4: Can Aradur 3776 XW55 be used in food-contact or potable water applications?
A: Aradur 3776 XW55 is not pre-qualified for direct food-contact or potable water service. Its suitability for such applications depends entirely on full system validation—including cured film testing per relevant regulatory frameworks—and must be confirmed through end-use testing and consultation with regulatory experts prior to deployment.
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
