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Low-viscosity polyamide curing agent enabling excellent flow and wetting of substrates.
Designed for ambient-cure epoxy systems with balanced pot life and rapid development of handling strength.
Provides outstanding adhesion to steel, concrete, and composite surfaces without primer.
Offers good chemical resistance, particularly to water, alkalis, and mild solvents.
Complies with REACH and is registered under the U.S. TSCA Inventory.
Structural bonding adhesives for transportation and industrial assembly.
High-performance epoxy mortars and grouts for concrete repair and anchoring.
Protective coatings for marine and offshore infrastructure.
Electrical encapsulation and potting compounds requiring low exotherm and dimensional stability.
| Chemical Type | Polyamide adduct |
| Product Form | Liquid |
| Appearance | Pale yellow to amber, clear to slightly hazy |
| Primary Applications | Ambient-cure structural adhesives, mortars, protective coatings |
| Key Features | Low viscosity, good substrate wetting, ambient cure capability |
| Benefits | Extended working time, rapid green strength build, no primer required on metals/concrete |
| Storage Stability | 12 months in original unopened container at 15–25°C |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
