Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

CCP BE-186 Solventborne Epoxy Resin

CCP BE-186 is a solventborne epoxy resin from CCP’s BE series, offering excellent adhesion, chemical resistance, and mechanical strength. Widely used in high-performance industrial coatings, primers, and marine applications, it ensures superior film formation and compatibility with amine hardeners. Designed for demanding environments, it delivers consistent viscosity and reliable curing performance.
  • ccp be 186 solventborne epoxy resin_61223d16
  • ccp be 186 solventborne epoxy resin_61223d16

Features Of CCP BE-186 Solventborne Epoxy Resin

  1. High molecular weight bisphenol-A based epoxy resin offering excellent chemical resistance and mechanical strength.

  2. Optimized solubility in common organic solvents including xylene, toluene, and ketones for stable formulation handling.

  3. Consistent epoxy equivalent weight (EEW) ensures predictable crosslink density and cure performance in two-component systems.

  4. Low chloride content (< 500 ppm) minimizes corrosion risk in protective coatings for metal substrates.

  5. Excellent compatibility with amine hardeners, polyamide resins, and phenalkamines for versatile curing profiles.

Typical Applications Of CCP BE-186 Solventborne Epoxy Resin

  1. Heavy-duty anticorrosive primers for offshore platforms and marine infrastructure.

  2. Industrial maintenance coatings for steel bridges, pipelines, and storage tanks.

  3. Electrical insulation varnishes for transformers and motor windings.

  4. High-build epoxy topcoats requiring solvent release control and film integrity.

  5. Adhesive formulations demanding thermal stability and substrate adhesion on metals and composites.

Specifications Of CCP BE-186 Solventborne Epoxy Resin

Chemical TypeBisphenol-A epoxy resin
Product FormClear to pale amber viscous liquid
AppearanceHomogeneous, free of sediment or haze
Epoxy Equivalent Weight (EEW)470–490 g/eq
Chlorine Content≤ 500 ppm
Viscosity (25°C)12,000–16,000 cP
Softening PointNot applicable (liquid at room temperature)
Solvent CompatibilityCompatible with aromatic hydrocarbons and ketones


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