High molecular weight bisphenol-A based epoxy resin offering excellent chemical resistance and mechanical strength.
Optimized solubility in common organic solvents including xylene, toluene, and ketones for stable formulation handling.
Consistent epoxy equivalent weight (EEW) ensures predictable crosslink density and cure performance in two-component systems.
Low chloride content (< 500 ppm) minimizes corrosion risk in protective coatings for metal substrates.
Excellent compatibility with amine hardeners, polyamide resins, and phenalkamines for versatile curing profiles.
Heavy-duty anticorrosive primers for offshore platforms and marine infrastructure.
Industrial maintenance coatings for steel bridges, pipelines, and storage tanks.
Electrical insulation varnishes for transformers and motor windings.
High-build epoxy topcoats requiring solvent release control and film integrity.
Adhesive formulations demanding thermal stability and substrate adhesion on metals and composites.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Clear to pale amber viscous liquid |
| Appearance | Homogeneous, free of sediment or haze |
| Epoxy Equivalent Weight (EEW) | 470–490 g/eq |
| Chlorine Content | ≤ 500 ppm |
| Viscosity (25°C) | 12,000–16,000 cP |
| Softening Point | Not applicable (liquid at room temperature) |
| Solvent Compatibility | Compatible with aromatic hydrocarbons and ketones |
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E-mail: wangxingqiang@ericwchem.com
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