High molecular weight solid epoxy resin with excellent thermal stability and low melt viscosity.
Low chlorine content, contributing to improved electrical insulation properties and reduced corrosion risk.
Consistent batch-to-batch performance and high purity for reliable formulation reproducibility.
Optimized for use with conventional amine and anhydride curing agents in thermoset systems.
Free-flowing granular form enabling efficient handling, metering, and blending in industrial processes.
Electrical encapsulation and potting compounds for transformers, sensors, and power electronics.
High-performance powder coatings for metal substrates requiring superior chemical and abrasion resistance.
Structural adhesives in aerospace and automotive composite bonding applications.
Insulating varnishes and impregnating resins for motor and generator windings.
Reinforced thermoset composites used in printed circuit board (PCB) laminates and prepregs.
| Chemical Type | Bisphenol-A based solid epoxy resin |
| Product Form | Free-flowing off-white granules |
| Appearance | Granular, free of visible foreign matter |
| Epoxy Equivalent Weight (EEW) | 485–515 g/eq |
| Melt Viscosity (at 175°C) | 15,000–25,000 cP |
| Softening Point (Ring & Ball) | 95–105°C |
| Total Chlorine Content | ≤ 800 ppm |
| Volatiles (125°C, 2 hrs) | ≤ 0.3 wt% |
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E-mail: wangxingqiang@ericwchem.com
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