Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Dow DER 667-20 Solid Epoxy Resin

Dow DER 667-20 Solid Epoxy Resin is a high-molecular-weight bisphenol-A epoxy resin from Dow’s DER™ series, offering excellent chemical resistance, thermal stability, and mechanical strength. Widely used in composites, adhesives, and powder coatings, it delivers superior crosslinking performance and low volatility.
  • dow der 667 20 solid epoxy resin_ab9c3ccd
  • dow der 667 20 solid epoxy resin_ab9c3ccd

Features Of Dow DER 667-20 Solid Epoxy Resin

  1. High molecular weight solid epoxy resin with excellent thermal stability and low melt viscosity.

  2. Low chlorine content, contributing to improved electrical insulation properties and reduced corrosion risk.

  3. Consistent batch-to-batch performance and high purity for reliable formulation reproducibility.

  4. Optimized for use with conventional amine and anhydride curing agents in thermoset systems.

  5. Free-flowing granular form enabling efficient handling, metering, and blending in industrial processes.

Typical Applications Of Dow DER 667-20 Solid Epoxy Resin

  1. Electrical encapsulation and potting compounds for transformers, sensors, and power electronics.

  2. High-performance powder coatings for metal substrates requiring superior chemical and abrasion resistance.

  3. Structural adhesives in aerospace and automotive composite bonding applications.

  4. Insulating varnishes and impregnating resins for motor and generator windings.

  5. Reinforced thermoset composites used in printed circuit board (PCB) laminates and prepregs.

Specifications Of Dow DER 667-20 Solid Epoxy Resin

Chemical TypeBisphenol-A based solid epoxy resin
Product FormFree-flowing off-white granules
AppearanceGranular, free of visible foreign matter
Epoxy Equivalent Weight (EEW)485–515 g/eq
Melt Viscosity (at 175°C)15,000–25,000 cP
Softening Point (Ring & Ball)95–105°C
Total Chlorine Content≤ 800 ppm
Volatiles (125°C, 2 hrs)≤ 0.3 wt%


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