High-performance, one-component, moisture-curing silicone adhesive with excellent adhesion to low-surface-energy substrates.
Offers outstanding resistance to thermal cycling, UV exposure, and weathering over extended service life.
Flexible, non-corrosive formulation suitable for sensitive electronic and optical assemblies.
Low modulus provides stress relief in bonded joints subject to vibration or differential thermal expansion.
Meets UL 94 HB flammability rating for enhanced safety in electrical and lighting applications.
LED module encapsulation and lens bonding in outdoor lighting fixtures.
Sealing and bonding of automotive sensors, headlamps, and camera housings.
Assembly of solar photovoltaic components including junction boxes and frame attachments.
Mounting of displays, touch panels, and control interfaces in industrial and medical equipment.
Bonding of glass, polycarbonate, and anodized aluminum in architectural glazing systems.
| Chemical Type | Acetoxy-cure silicone polymer |
| Product Form | Paste, thixotropic, ready-to-use |
| Appearance | Off-white to light tan, uniform paste |
| Primary Applications | Structural bonding, sealing, and potting in electronics, automotive, and renewable energy |
| Key Features | Room-temperature cure, no primer required on most substrates |
| Benefits | Reduced assembly time, improved long-term reliability, low outgassing |
| Cure Mechanism | Moisture-curing (acetoxy release) |
| Shelf Life (unopened) | 12 months at ≤25 °C in original sealed container |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China