Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Dow DOWSIL SE 4486 Thermally Conductive Silicone Adhesive

Dow DOWSIL SE 4486 is a thermally conductive silicone adhesive offering excellent heat dissipation, electrical insulation, and flexible bonding for electronics. It cures at room temperature or accelerated with mild heat, adheres reliably to metals, plastics, and ceramics, and maintains stability across -50°C to 200°C. Ideal for LED assembly, power modules, and thermal interface applications requiring long-term reliability and low stress.
  • dow dowsil se 4486 thermally conductive silicone adhesive_7bb64852
  • dow dowsil se 4486 thermally conductive silicone adhesive_7bb64852

Features Of Dow DOWSIL SE 4486 Thermally Conductive Silicone Adhesive

  1. High thermal conductivity (1.5 W/m·K) for efficient heat dissipation in demanding electronic assemblies.

  2. Low modulus silicone formulation provides excellent stress relief and long-term reliability under thermal cycling.

  3. Room-temperature vulcanizing (RTV) with rapid tack-free time and full cure within 24 hours at ambient conditions.

  4. Excellent adhesion to common substrates including aluminum, copper, stainless steel, and FR-4 PCBs without primers.

  5. UL 94 V-0 rated for flame retardancy and compliant with RoHS and REACH regulations.

Typical Applications Of Dow DOWSIL SE 4486 Thermally Conductive Silicone Adhesive

  1. Thermal bonding of power electronics modules (e.g., IGBTs, MOSFETs) to heat sinks.

  2. Attachment of LED packages and drivers in high-brightness lighting systems.

  3. Die-attach and heat sink mounting in automotive ADAS and infotainment control units.

  4. Thermal interface bonding in 5G base station power amplifiers and RF modules.

Specifications Of Dow DOWSIL SE 4486 Thermally Conductive Silicone Adhesive

Chemical TypePlatinum-cured addition-cure silicone elastomer
Product FormTwo-component (Part A: filler-rich paste; Part B: catalyst paste)
AppearanceOff-white, non-sag paste (Part A); colorless to pale yellow paste (Part B)
Primary ApplicationsStructural thermal bonding and gap-filling in power electronics
Key FeaturesThermally conductive, electrically insulating, low-stress, RTV-curing
BenefitsReduces thermal resistance, prevents delamination under thermal cycling, eliminates mechanical fasteners
Cure SystemAddition cure (platinum catalyzed), no by-products
Storage Stability12 months at ≤25 °C in unopened containers


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