High thermal conductivity (1.5 W/m·K) for efficient heat dissipation in demanding electronic assemblies.
Low modulus silicone formulation provides excellent stress relief and long-term reliability under thermal cycling.
Room-temperature vulcanizing (RTV) with rapid tack-free time and full cure within 24 hours at ambient conditions.
Excellent adhesion to common substrates including aluminum, copper, stainless steel, and FR-4 PCBs without primers.
UL 94 V-0 rated for flame retardancy and compliant with RoHS and REACH regulations.
Thermal bonding of power electronics modules (e.g., IGBTs, MOSFETs) to heat sinks.
Attachment of LED packages and drivers in high-brightness lighting systems.
Die-attach and heat sink mounting in automotive ADAS and infotainment control units.
Thermal interface bonding in 5G base station power amplifiers and RF modules.
| Chemical Type | Platinum-cured addition-cure silicone elastomer |
| Product Form | Two-component (Part A: filler-rich paste; Part B: catalyst paste) |
| Appearance | Off-white, non-sag paste (Part A); colorless to pale yellow paste (Part B) |
| Primary Applications | Structural thermal bonding and gap-filling in power electronics |
| Key Features | Thermally conductive, electrically insulating, low-stress, RTV-curing |
| Benefits | Reduces thermal resistance, prevents delamination under thermal cycling, eliminates mechanical fasteners |
| Cure System | Addition cure (platinum catalyzed), no by-products |
| Storage Stability | 12 months at ≤25 °C in unopened containers |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China