Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Dow DOWSIL Q1-9226 Thermally Conductive Silicone Adhesive

Dow DOWSIL Q1-9226 is a thermally conductive silicone adhesive offering excellent heat dissipation, electrical insulation, and flexible bonding for electronics. It cures at room temperature or accelerated with heat, maintains stability from -50°C to 200°C, and adheres reliably to metals, plastics, and ceramics—ideal for LED assemblies, power modules, and thermal interface applications.
  • dow dowsil q1 9226 thermally conductive silicone adhesive_fef0201d
  • dow dowsil q1 9226 thermally conductive silicone adhesive_fef0201d

Features Of Dow DOWSIL Q1-9226 Thermally Conductive Silicone Adhesive

  1. High thermal conductivity for efficient heat dissipation in demanding electronic assemblies.

  2. Low modulus silicone formulation provides excellent stress relief and long-term reliability under thermal cycling.

  3. Room-temperature vulcanizing (RTV) cure enables easy, tool-free application without oven baking.

  4. Excellent adhesion to common substrates including aluminum, copper, ceramics, and FR-4 PCBs.

  5. UL 94 V-0 rated for flame resistance, supporting safety-compliant designs.

Typical Applications Of Dow DOWSIL Q1-9226 Thermally Conductive Silicone Adhesive

  1. Thermal bonding of power semiconductors (IGBTs, MOSFETs) to heat sinks in industrial inverters.

  2. Attachment of LED modules and drivers in high-brightness lighting systems.

  3. Die-attach and heat sink mounting in automotive ADAS and EV power electronics.

  4. Thermal interface bonding in telecom base station RF power amplifiers.

  5. Encapsulation and thermal management of sensors and control units in harsh-environment equipment.

Specifications Of Dow DOWSIL Q1-9226 Thermally Conductive Silicone Adhesive

Chemical TypePlatinum-cured addition-cure silicone elastomer
Product FormPaste (two-component, Part A + Part B)
AppearanceOff-white, homogeneous paste
Primary ApplicationsStructural thermal bonding and heat sink attachment
Key FeaturesThermally conductive, electrically insulating, low modulus, RTV cure
BenefitsReduces thermal resistance, absorbs mechanical stress, improves long-term reliability
Cure SystemAddition cure (platinum catalyst), no by-products
UL RecognitionUL 94 V-0 (per UL 746C)


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