High thermal conductivity for efficient heat dissipation in demanding electronic assemblies.
Low modulus silicone formulation provides excellent stress relief and long-term reliability under thermal cycling.
Room-temperature vulcanizing (RTV) cure enables easy, tool-free application without oven baking.
Excellent adhesion to common substrates including aluminum, copper, ceramics, and FR-4 PCBs.
UL 94 V-0 rated for flame resistance, supporting safety-compliant designs.
Thermal bonding of power semiconductors (IGBTs, MOSFETs) to heat sinks in industrial inverters.
Attachment of LED modules and drivers in high-brightness lighting systems.
Die-attach and heat sink mounting in automotive ADAS and EV power electronics.
Thermal interface bonding in telecom base station RF power amplifiers.
Encapsulation and thermal management of sensors and control units in harsh-environment equipment.
| Chemical Type | Platinum-cured addition-cure silicone elastomer |
| Product Form | Paste (two-component, Part A + Part B) |
| Appearance | Off-white, homogeneous paste |
| Primary Applications | Structural thermal bonding and heat sink attachment |
| Key Features | Thermally conductive, electrically insulating, low modulus, RTV cure |
| Benefits | Reduces thermal resistance, absorbs mechanical stress, improves long-term reliability |
| Cure System | Addition cure (platinum catalyst), no by-products |
| UL Recognition | UL 94 V-0 (per UL 746C) |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China