Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Dow DOWSIL 3-4222 Dielectric Gel Kit

Dow DOWSIL 3-4222 Dielectric Gel Kit is a two-part silicone-based insulating gel system designed for high-voltage electrical encapsulation and thermal management. It offers excellent dielectric strength, low viscosity for easy dispensing, and long-term stability across wide temperature ranges. Ideal for EV battery modules, power electronics, and renewable energy systems.
  • dow dowsil 3 4222 dielectric gel kit_a8d99431
  • dow dowsil 3 4222 dielectric gel kit_a8d99431

Features Of Dow DOWSIL 3-4222 Dielectric Gel Kit

  1. Non-corrosive, silicone-based formulation safe for sensitive electronic components and metals.

  2. Excellent dielectric strength (>20 kV/mm) for reliable electrical insulation under high-voltage conditions.

  3. Thixotropic gel consistency ensures no sagging or migration after application, even in vertical or overhead assemblies.

  4. Wide operating temperature range from –55 °C to +200 °C, maintaining stability across thermal cycling.

  5. Low volatility and non-yellowing properties ensure long-term optical clarity and performance retention.

Typical Applications Of Dow DOWSIL 3-4222 Dielectric Gel Kit

  1. Insulation and protection of high-voltage connectors in electric vehicle (EV) powertrain systems.

  2. Dielectric filling for LED module housings and automotive lighting assemblies.

  3. Gap-filling encapsulation of power electronics, including IGBT modules and DC-DC converters.

  4. Moisture and contamination barrier for sensors and control units in industrial automation equipment.

  5. Thermal interface and electrical isolation in renewable energy inverters and battery management systems (BMS).

Specifications Of Dow DOWSIL 3-4222 Dielectric Gel Kit

Chemical TypeAlkoxy-cured silicone gel
Product FormTwo-component kit (Part A + Part B)
AppearanceTranslucent, viscous gel (Part A); colorless to pale amber liquid (Part B)
Primary ApplicationsElectrical insulation, environmental protection, and stress relief in high-reliability electronics
Key FeaturesNon-corrosive, low modulus, reworkable before full cure, UL 94 V-0 rated (cured)
BenefitsReduces thermal and mechanical stress on solder joints; inhibits dendritic growth; enables conformal coverage of irregular surfaces
Cure SystemRoom-temperature curing (accelerated with mild heat: 60–80 °C)
Shelf Life12 months unopened at 25 °C (stored in original sealed containers)


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