Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Dow DOWSIL SE 4448 CV Kit Parts A&B Thermally Conductive Silicone Adhesive

Dow DOWSIL SE 4448 CV Kit Parts A&B is a two-component thermally conductive silicone adhesive offering excellent thermal management, low modulus elasticity, and rapid room-temperature cure. Ideal for bonding heat-sensitive electronics, it delivers high thermal conductivity (1.5 W/mK), electrical insulation, and long-term reliability across wide temperature ranges.
  • dow dowsil se 4448 cv kit parts a b thermally conductive silicone adhesive_d6c64562
  • dow dowsil se 4448 cv kit parts a b thermally conductive silicone adhesive_d6c64562

Features Of Dow DOWSIL SE 4448 CV Kit Parts A&B Thermally Conductive Silicone Adhesive

  1. Two-part, addition-cure silicone system with excellent thermal conductivity for reliable heat dissipation.

  2. Low modulus and high flexibility after cure, minimizing stress on sensitive electronic components.

  3. Room-temperature or elevated-temperature curing options provide processing flexibility in manufacturing environments.

  4. Excellent adhesion to a wide range of substrates including metals, ceramics, and engineered plastics without primers.

  5. UL 94 V-0 rated for flame retardancy, supporting safety compliance in demanding electronics applications.

Typical Applications Of Dow DOWSIL SE 4448 CV Kit Parts A&B Thermally Conductive Silicone Adhesive

  1. Thermal interface bonding of power modules and IGBTs in electric vehicle inverters.

  2. Attachment and heat transfer between LED packages and metal-core printed circuit boards (MCPCBs).

  3. Die-attach and thermal management of high-power semiconductor devices in industrial power supplies.

  4. Structural bonding and thermal path creation for battery module cold plates and cell-to-pack assemblies.

Specifications Of Dow DOWSIL SE 4448 CV Kit Parts A&B Thermally Conductive Silicone Adhesive

Chemical TypePlatinum-catalyzed addition-cure silicone
Product FormTwo-component kit (Part A and Part B)
Appearance (Uncured)Part A: Gray paste; Part B: Colorless to pale yellow liquid
Primary ApplicationsThermal interface material (TIM), structural thermal bonding
Key FeaturesThermally conductive, flexible, low-stress, flame-retardant
BenefitsReduces thermal resistance, accommodates CTE mismatch, enhances long-term reliability
Curing MechanismHeat-assisted or room-temperature addition cure (accelerated by elevated temperature)
Storage Stability12 months at ≤25 °C in unopened containers


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