Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

DOWSIL 1-4173 Thermally Conductive Silicone Adhesive

DOWSIL 1-4173 is a thermally conductive silicone adhesive from Dow’s DOWSIL™ series, engineered for high-reliability bonding and heat dissipation in electronics. It offers excellent thermal conductivity (1.5 W/m·K), low modulus, and strong adhesion to metals, plastics, and ceramics. Cures at room temperature or accelerated with heat, providing long-term stability across wide temperature ranges (–60°C to 200°C).
  • dowsil 1 4173 thermally conductive silicone adhesive_00981864
  • dowsil 1 4173 thermally conductive silicone adhesive_00981864

Features Of DOWSIL 1-4173 Thermally Conductive Silicone Adhesive

  1. High thermal conductivity (1.5 W/m·K) for efficient heat dissipation in demanding electronic assemblies.

  2. Low modulus silicone formulation provides excellent stress relief and long-term reliability under thermal cycling.

  3. Room-temperature vulcanizing (RTV) cure with tack-free time of ~30 minutes and full cure in 24 hours at 25°C/50% RH.

  4. Excellent adhesion to common substrates including aluminum, copper, FR-4, and molded plastics without primers.

  5. UL 94 V-0 rated for flame resistance and compliant with RoHS 2015/863/EU and REACH SVHC regulations.

Typical Applications Of DOWSIL 1-4173 Thermally Conductive Silicone Adhesive

  1. Thermal interface bonding of power modules, IGBTs, and MOSFETs to heat sinks in EV inverters and onboard chargers.

  2. Die-attach and heat sink attachment in high-power LED lighting systems requiring long-life thermal stability.

  3. Permanent thermal bonding of sensors, battery management system (BMS) components, and DC-DC converters.

  4. Structural thermal attachment in industrial motor drives, renewable energy inverters, and rail traction electronics.

Specifications Of DOWSIL 1-4173 Thermally Conductive Silicone Adhesive

Chemical TypePlatinum-cured addition-cure silicone elastomer
Product FormTwo-part paste (Part A: filler-rich base; Part B: catalyst)
AppearanceOff-white, homogeneous paste
Primary ApplicationsThermal interface material (TIM), structural thermal adhesive, die-attach
Key FeaturesThermally conductive, electrically insulating, low-stress, RTV-curing
BenefitsReduces interfacial thermal resistance, accommodates CTE mismatch, enables automated dispensing
Shelf Life12 months unopened at ≤25°C
Packaging300 mL dual-cartridge (10:1 volume ratio), also available in 1 kg pails


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