High thermal conductivity (1.5 W/m·K) for efficient heat dissipation in demanding electronic assemblies.
Low modulus silicone formulation provides excellent stress relief and long-term reliability under thermal cycling.
Room-temperature vulcanizing (RTV) cure with tack-free time of ~30 minutes and full cure in 24 hours at 25°C/50% RH.
Excellent adhesion to common substrates including aluminum, copper, FR-4, and molded plastics without primers.
UL 94 V-0 rated for flame resistance and compliant with RoHS 2015/863/EU and REACH SVHC regulations.
Thermal interface bonding of power modules, IGBTs, and MOSFETs to heat sinks in EV inverters and onboard chargers.
Die-attach and heat sink attachment in high-power LED lighting systems requiring long-life thermal stability.
Permanent thermal bonding of sensors, battery management system (BMS) components, and DC-DC converters.
Structural thermal attachment in industrial motor drives, renewable energy inverters, and rail traction electronics.
| Chemical Type | Platinum-cured addition-cure silicone elastomer |
| Product Form | Two-part paste (Part A: filler-rich base; Part B: catalyst) |
| Appearance | Off-white, homogeneous paste |
| Primary Applications | Thermal interface material (TIM), structural thermal adhesive, die-attach |
| Key Features | Thermally conductive, electrically insulating, low-stress, RTV-curing |
| Benefits | Reduces interfacial thermal resistance, accommodates CTE mismatch, enables automated dispensing |
| Shelf Life | 12 months unopened at ≤25°C |
| Packaging | 300 mL dual-cartridge (10:1 volume ratio), also available in 1 kg pails |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China