Two-part, platinum-cured silicone gel offering ultra-low modulus and exceptional conformability for delicate electronic components.
Self-healing properties enable recovery from punctures and mechanical stress without compromising protective integrity.
Excellent thermal stability with continuous service temperature range from –50 °C to +200 °C.
Low ionic content and high purity ensure compatibility with sensitive semiconductors and optoelectronic devices.
Non-corrosive, VOC-free formulation compliant with RoHS and REACH regulatory requirements.
Encapsulation and protection of LED arrays and power modules in automotive lighting systems.
Conformal cushioning for MEMS sensors and precision accelerometers in aerospace and industrial control units.
Thermal interface and mechanical buffering for battery management systems (BMS) in EVs and energy storage.
Dielectric isolation and shock absorption for high-voltage inverters and IGBT modules.
Protection of flexible printed circuits (FPCs) and wearable electronics subjected to repeated flexing.
| Chemical Type | Platinum-cured addition-cure silicone gel |
| Product Form | Two-component kit (Part A + Part B) |
| Appearance | Translucent, viscous liquid (Part A); translucent, low-viscosity liquid (Part B) |
| Mix Ratio by Weight | 10:1 (A:B) |
| Cure Mechanism | Room-temperature or elevated-temperature addition cure |
| Shore A Hardness (Cured) | 5–10 (ASTM D2240) |
| Density (Cured) | Approx. 1.10 g/cm³ (ISO 1183) |
| Primary Applications | Electronic encapsulation, thermal management, mechanical damping, and environmental protection |
Q1: What is the primary function of the DOWSIL 3-4680 Silicone Gel Kit in electronic encapsulation applications?
A: The DOWSIL 3-4680 Silicone Gel Kit is a two-part, addition-cure silicone system formulated to provide soft, low-modulus protection for sensitive electronic components. It offers excellent thermal stability, low stress relief during thermal cycling, and superior conformal coverage over irregular surfaces and fine-pitch features.
Q2: How does the mixing ratio and pot life affect processing flexibility?
A: DOWSIL 3-4680 is supplied as a two-component kit with a simple 1:1 mix-by-volume ratio, enabling straightforward handling and reduced formulation risk. Its extended working time at room temperature supports manual dispensing, automated meter-mix systems, and moderate batch sizes—ideal for prototyping and medium-volume production without requiring strict environmental controls.
Q3: Is post-cure required to achieve full performance properties?
A: While DOWSIL 3-4680 achieves functional cure at room temperature, a mild thermal post-cure (e.g., 60–80 °C for 1–2 hours) is recommended to maximize crosslink density, enhance long-term thermal aging resistance, and optimize dielectric stability—particularly for high-reliability or elevated-temperature service environments.
Q4: Can this gel be used for optical applications such as LED lens encapsulation?
A: DOWSIL 3-4680 is not optimized for high-transmission optical applications. It is formulated for protective encapsulation rather than clarity or refractive index matching. For optical-grade performance—including UV stability and high light transmission—Dow offers dedicated optical silicone gels such as DOWSIL OE-6630 or similar series.
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