Two-part, platinum-cured silicone gel offering ultra-low modulus and exceptional conformability for delicate electronic components.
Self-healing properties enable recovery from punctures and mechanical stress without compromising protective integrity.
Excellent thermal stability with continuous service temperature range from –50 °C to +200 °C.
Low ionic content and high purity ensure compatibility with sensitive semiconductors and optoelectronic devices.
Non-corrosive, VOC-free formulation compliant with RoHS and REACH regulatory requirements.
Encapsulation and protection of LED arrays and power modules in automotive lighting systems.
Conformal cushioning for MEMS sensors and precision accelerometers in aerospace and industrial control units.
Thermal interface and mechanical buffering for battery management systems (BMS) in EVs and energy storage.
Dielectric isolation and shock absorption for high-voltage inverters and IGBT modules.
Protection of flexible printed circuits (FPCs) and wearable electronics subjected to repeated flexing.
| Chemical Type | Platinum-cured addition-cure silicone gel |
| Product Form | Two-component kit (Part A + Part B) |
| Appearance | Translucent, viscous liquid (Part A); translucent, low-viscosity liquid (Part B) |
| Mix Ratio by Weight | 10:1 (A:B) |
| Cure Mechanism | Room-temperature or elevated-temperature addition cure |
| Shore A Hardness (Cured) | 5–10 (ASTM D2240) |
| Density (Cured) | Approx. 1.10 g/cm³ (ISO 1183) |
| Primary Applications | Electronic encapsulation, thermal management, mechanical damping, and environmental protection |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China