Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Dow DOWSIL 3-4680 Silicone Gel Kit

Dow DOWSIL 3-4680 Silicone Gel Kit is a two-part, addition-cure silicone system offering low modulus, excellent thermal stability, and outstanding protection for sensitive electronics. It cures to a soft, conformal gel with superior stress relief, moisture resistance, and long-term reliability—ideal for LED lighting, power modules, and automotive electronics applications.
  • dow dowsil 3 4680 silicone gel kit_95041733
  • dow dowsil 3 4680 silicone gel kit_95041733

Features Of Dow DOWSIL 3-4680 Silicone Gel Kit

  1. Two-part, platinum-cured silicone gel offering ultra-low modulus and exceptional conformability for delicate electronic components.

  2. Self-healing properties enable recovery from punctures and mechanical stress without compromising protective integrity.

  3. Excellent thermal stability with continuous service temperature range from –50 °C to +200 °C.

  4. Low ionic content and high purity ensure compatibility with sensitive semiconductors and optoelectronic devices.

  5. Non-corrosive, VOC-free formulation compliant with RoHS and REACH regulatory requirements.

Typical Applications Of Dow DOWSIL 3-4680 Silicone Gel Kit

  1. Encapsulation and protection of LED arrays and power modules in automotive lighting systems.

  2. Conformal cushioning for MEMS sensors and precision accelerometers in aerospace and industrial control units.

  3. Thermal interface and mechanical buffering for battery management systems (BMS) in EVs and energy storage.

  4. Dielectric isolation and shock absorption for high-voltage inverters and IGBT modules.

  5. Protection of flexible printed circuits (FPCs) and wearable electronics subjected to repeated flexing.

Specifications Of Dow DOWSIL 3-4680 Silicone Gel Kit

Chemical TypePlatinum-cured addition-cure silicone gel
Product FormTwo-component kit (Part A + Part B)
AppearanceTranslucent, viscous liquid (Part A); translucent, low-viscosity liquid (Part B)
Mix Ratio by Weight10:1 (A:B)
Cure MechanismRoom-temperature or elevated-temperature addition cure
Shore A Hardness (Cured)5–10 (ASTM D2240)
Density (Cured)Approx. 1.10 g/cm³ (ISO 1183)
Primary ApplicationsElectronic encapsulation, thermal management, mechanical damping, and environmental protection


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