High thermal conductivity for efficient heat dissipation in demanding electronic assemblies.
Excellent long-term reliability under thermal cycling and high-temperature operating conditions.
Low modulus silicone formulation enables stress relief and minimizes mechanical stress on sensitive components.
Room-temperature curing with optional heat acceleration, supporting flexible manufacturing workflows.
Good adhesion to a wide range of substrates including metals, ceramics, and common engineering plastics.
Thermal interface bonding of power modules and IGBTs in electric vehicle inverters.
Heat sink attachment in LED lighting systems requiring stable performance over extended lifetimes.
Die-attach and component mounting in industrial power electronics and renewable energy converters.
Thermal management solutions for 5G base station RF power amplifiers and telecom infrastructure.
| Chemical Type | Platinum-cured silicone elastomer |
| Product Form | Paste (two-component, A+B) |
| Appearance | Off-white to light gray, homogeneous paste |
| Primary Applications | Structural thermal bonding and heat dissipation in power electronics |
| Key Features | Thermally conductive, electrically insulating, low-stress cure |
| Benefits | Reduces thermal resistance, enhances device reliability, simplifies assembly |
| Curing Mechanism | Room temperature or elevated temperature (e.g., 60–125 °C) |
| Storage Stability | ≥6 months at 25 °C (unopened, sealed containers) |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China