Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Dow DOWSIL SE 4422 Thermally Conductive Silicone Adhesive

Dow DOWSIL SE 4422 is a thermally conductive silicone adhesive offering excellent heat dissipation, electrical insulation, and long-term reliability for bonding heat sinks to power electronics. It cures at room temperature or accelerated with mild heat, delivers low thermal resistance, and maintains flexibility across wide temperature ranges. Ideal for EV inverters, LED lighting, and 5G infrastructure.
  • dow dowsil se 4422 thermally conductive silicone adhesive_3cbd0de7
  • dow dowsil se 4422 thermally conductive silicone adhesive_3cbd0de7

Features Of Dow DOWSIL SE 4422 Thermally Conductive Silicone Adhesive

  1. High thermal conductivity for efficient heat dissipation in demanding electronic assemblies.

  2. Excellent long-term reliability under thermal cycling and high-temperature operating conditions.

  3. Low modulus silicone formulation enables stress relief and minimizes mechanical stress on sensitive components.

  4. Room-temperature curing with optional heat acceleration, supporting flexible manufacturing workflows.

  5. Good adhesion to a wide range of substrates including metals, ceramics, and common engineering plastics.

Typical Applications Of Dow DOWSIL SE 4422 Thermally Conductive Silicone Adhesive

  1. Thermal interface bonding of power modules and IGBTs in electric vehicle inverters.

  2. Heat sink attachment in LED lighting systems requiring stable performance over extended lifetimes.

  3. Die-attach and component mounting in industrial power electronics and renewable energy converters.

  4. Thermal management solutions for 5G base station RF power amplifiers and telecom infrastructure.

Specifications Of Dow DOWSIL SE 4422 Thermally Conductive Silicone Adhesive

Chemical TypePlatinum-cured silicone elastomer
Product FormPaste (two-component, A+B)
AppearanceOff-white to light gray, homogeneous paste
Primary ApplicationsStructural thermal bonding and heat dissipation in power electronics
Key FeaturesThermally conductive, electrically insulating, low-stress cure
BenefitsReduces thermal resistance, enhances device reliability, simplifies assembly
Curing MechanismRoom temperature or elevated temperature (e.g., 60–125 °C)
Storage Stability≥6 months at 25 °C (unopened, sealed containers)


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