Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Dow DOWSIL 3-6751 Thermally Conductive Adhesive

Dow DOWSIL 3-6751 is a thermally conductive adhesive from Dow’s DOWSIL™ silicone portfolio, offering high thermal conductivity (>1.5 W/m·K), low modulus, and excellent bond strength to metals, plastics, and ceramics. It cures at room temperature or accelerated with heat, providing reliable gap-filling and long-term stability in EV battery modules, power electronics, and LED assemblies.
  • dow dowsil 3 6751 thermally conductive adhesive_5aa6bd96
  • dow dowsil 3 6751 thermally conductive adhesive_5aa6bd96

Features Of Dow DOWSIL 3-6751 Thermally Conductive Adhesive

  1. High thermal conductivity (≥1.5 W/m·K) for efficient heat dissipation in demanding electronic assemblies.

  2. Room-temperature cure with optional heat acceleration, enabling flexible manufacturing integration.

  3. Excellent adhesion to diverse substrates including aluminum, copper, ceramics, and FR-4 PCBs.

  4. Low modulus formulation provides stress relief under thermal cycling and mechanical vibration.

  5. UL 94 V-0 rated for flame resistance, supporting safety-compliant end-use designs.

Typical Applications Of Dow DOWSIL 3-6751 Thermally Conductive Adhesive

  1. Thermal bonding of power electronics modules (e.g., IGBTs, SiC MOSFETs) to heat sinks.

  2. Attachment of LED packages and COB (Chip-on-Board) arrays in high-brightness lighting systems.

  3. Die-attach and heat-spreader bonding in automotive ADAS and infotainment control units.

  4. Thermal interface solution for 5G base station RF power amplifiers and mmWave modules.

Specifications Of Dow DOWSIL 3-6751 Thermally Conductive Adhesive

Chemical TypeSilicone-based thermally conductive adhesive
Product FormPaste (two-component, A+B)
AppearanceGray, homogeneous paste
Primary ApplicationsStructural thermal bonding in power electronics and LED systems
Key FeaturesThermally conductive, electrically insulating, low-stress, flame retardant
BenefitsReduces thermal resistance, improves reliability under thermal cycling, simplifies assembly vs. mechanical fastening
Cure Profile (RT)7 days at 25°C; accelerated cure: 1 hour at 80°C
UL RecognitionUL 94 V-0 (per UL 746C)


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