High thermal conductivity (≥1.5 W/m·K) for efficient heat dissipation in demanding electronic assemblies.
Room-temperature cure with optional heat acceleration, enabling flexible manufacturing integration.
Excellent adhesion to diverse substrates including aluminum, copper, ceramics, and FR-4 PCBs.
Low modulus formulation provides stress relief under thermal cycling and mechanical vibration.
UL 94 V-0 rated for flame resistance, supporting safety-compliant end-use designs.
Thermal bonding of power electronics modules (e.g., IGBTs, SiC MOSFETs) to heat sinks.
Attachment of LED packages and COB (Chip-on-Board) arrays in high-brightness lighting systems.
Die-attach and heat-spreader bonding in automotive ADAS and infotainment control units.
Thermal interface solution for 5G base station RF power amplifiers and mmWave modules.
| Chemical Type | Silicone-based thermally conductive adhesive |
| Product Form | Paste (two-component, A+B) |
| Appearance | Gray, homogeneous paste |
| Primary Applications | Structural thermal bonding in power electronics and LED systems |
| Key Features | Thermally conductive, electrically insulating, low-stress, flame retardant |
| Benefits | Reduces thermal resistance, improves reliability under thermal cycling, simplifies assembly vs. mechanical fastening |
| Cure Profile (RT) | 7 days at 25°C; accelerated cure: 1 hour at 80°C |
| UL Recognition | UL 94 V-0 (per UL 746C) |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China