High-performance film adhesive formulated for demanding aerospace bonding applications.
Excellent elevated-temperature resistance up to 177 °C (350 °F) post-cure.
Outstanding peel and shear strength retention after humidity exposure and thermal cycling.
Consistent thickness and handling characteristics with low tack for precise layup and drape.
Compatible with automated tape-laying and hand-layup processes on composite and metal substrates.
Aerospace primary and secondary structural bonding of carbon fiber reinforced polymer (CFRP) components.
Bonding of titanium and aluminum alloy parts in airframe assemblies.
Joining of honeycomb core sandwich panels for radomes, fairings, and control surfaces.
Repair bonding of composite structures under certified maintenance procedures.
| Chemical Type | Modified phenolic resin system |
| Product Form | Unsupported film (supplied on release liner) |
| Appearance | Uniform brown film, smooth surface |
| Standard Thickness | 0.13 mm (5.0 mils) |
| Storage Conditions | -18 °C (0 °F) or below; stable for 12 months when sealed |
| Cure Cycle (Typical) | 177 °C (350 °F) at 0.69 MPa (100 psi) for 90 minutes |
| Primary Applications | Aerospace structural bonding |
| Key Features | High Tg, low volatile content, excellent out-time stability |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China