Two-component, room-temperature curing epoxy system with excellent pot life and controlled working time.
High bond strength to metals, composites, ceramics, and engineered plastics without surface priming.
Outstanding resistance to thermal cycling, humidity, and common industrial chemicals including oils and solvents.
Low shrinkage during cure ensures dimensional stability and minimal stress at bonded interfaces.
Halogen-free formulation compliant with RoHS and REACH regulatory requirements.
Aerospace component assembly, including sensor mounting and structural bonding of aluminum and titanium substrates.
Electronics encapsulation and die attachment in power modules and high-reliability PCB assemblies.
Automotive powertrain applications such as sensor housing bonding and electric motor stator fixation.
Industrial machinery repair, including wear-resistant metal-to-metal re-bonding and precision fixture anchoring.
| Chemical Type | Bisphenol-A based epoxy resin with amine hardener |
| Product Form | Two-component liquid (Part A: resin, Part B: hardener) |
| Appearance | Part A: pale amber transparent liquid; Part B: light yellow transparent liquid |
| Mix Ratio (by weight) | 100 : 35 (A : B) |
| Cure Schedule | 24 hours at 25°C or 4 hours at 60°C |
| Tensile Shear Strength (Al/Al) | ≥22 MPa after full cure |
| Glass Transition Temperature (Tg) | ≈95°C (DSC, second heat) |
| Storage Stability | 12 months unopened at ≤25°C |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China