Primerless adhesion to challenging substrates including anodized aluminum, powder-coated metals, and painted surfaces without surface pretreatment.
High-performance one-component, moisture-curing silicone adhesive with excellent long-term durability and UV resistance.
Low modulus formulation provides superior stress relief and accommodates thermal and mechanical movement in dynamic joints.
Non-corrosive to sensitive metals such as copper, brass, and aluminum—ideal for electronics and architectural applications.
Meets ASTM C920 Type S, Grade NS, Class 25, T, NT performance requirements for structural silicone sealants.
Structural glazing of commercial façades and curtain walls on coated or anodized aluminum framing.
Bonding and sealing of insulated glass (IG) units with non-standard or pre-finished spacers and frames.
Attachment of architectural metal panels, signage, and decorative cladding systems without priming.
Sealing and bonding in transportation applications including railcar and bus exterior assemblies.
Electronics enclosures and LED lighting housings requiring non-corrosive, low-stress adhesion.
| Chemical Type | Acetoxy-cure silicone polymer |
| Product Form | Thixotropic paste, single-component |
| Appearance | Opaque white or gray (depending on variant) |
| Primary Applications | Structural glazing, architectural bonding, IG unit assembly |
| Key Features | Primerless adhesion, low modulus, non-corrosive, UV stable |
| Benefits | Reduced labor and process steps, improved production efficiency, enhanced joint longevity |
| Curing Mechanism | Moisture-cured at ambient temperature |
| Shelf Life (unopened) | 12 months from date of manufacture when stored at ≤25°C |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China