Two-component, room-temperature curing epoxy system with balanced toughness and rigidity.
Excellent adhesion to metals, composites, ceramics, and thermoset plastics without surface priming.
Low viscosity formulation enables precise dispensing and superior gap-filling capability up to 1.5 mm.
UL 94 V-0 rated for flame retardancy; halogen-free and RoHS compliant.
Outstanding resistance to thermal cycling (−40 °C to +120 °C) and long-term humidity exposure.
Aerospace component bonding, including sensor mounting and composite-to-metal structural joints.
Electronics encapsulation and potting of power modules, transformers, and high-reliability PCB assemblies.
Automotive powertrain and EV battery module assembly requiring vibration damping and thermal stability.
Industrial machinery repair, especially for static load-bearing metal-to-metal re-bonding under ambient conditions.
Medical device manufacturing where biocompatibility support documentation and low outgassing are critical.
| Chemical Type | Bisphenol-A based epoxy resin with amine hardener |
| Product Form | Two-component liquid system (Part A: resin, Part B: hardener) |
| Appearance | Part A: pale amber transparent liquid; Part B: light yellow transparent liquid |
| Mix Ratio by Weight | 100 : 35 (A : B) |
| Working Life at 25 °C | 60–75 minutes after mixing |
| Full Cure Time | 7 days at 25 °C or 24 hours at 80 °C |
| Primary Applications | Structural bonding, potting, and encapsulation in demanding industrial environments |
| Key Features | Room-temperature cure, halogen-free, UL 94 V-0, low shrinkage |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China