Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

PUCONS 2058 Epoxy Adhesive

PUCONS 2058 Epoxy Adhesive is a two-component, high-strength structural adhesive from the PUCONS industrial epoxy series. It delivers excellent adhesion to metals, composites, and plastics, with superior chemical resistance, thermal stability up to 120°C, and low shrinkage. Ideal for aerospace, automotive, and electronics bonding applications requiring precision and durability.
  • pucons 2058 epoxy adhesive_8076ddeb
  • pucons 2058 epoxy adhesive_8076ddeb

Features Of PUCONS 2058 Epoxy Adhesive

  1. Two-component, room-temperature curing epoxy system with balanced toughness and rigidity.

  2. Excellent adhesion to metals, composites, ceramics, and thermoset plastics without surface priming.

  3. Low viscosity formulation enables precise dispensing and superior gap-filling capability up to 1.5 mm.

  4. UL 94 V-0 rated for flame retardancy; halogen-free and RoHS compliant.

  5. Outstanding resistance to thermal cycling (−40 °C to +120 °C) and long-term humidity exposure.

Typical Applications Of PUCONS 2058 Epoxy Adhesive

  1. Aerospace component bonding, including sensor mounting and composite-to-metal structural joints.

  2. Electronics encapsulation and potting of power modules, transformers, and high-reliability PCB assemblies.

  3. Automotive powertrain and EV battery module assembly requiring vibration damping and thermal stability.

  4. Industrial machinery repair, especially for static load-bearing metal-to-metal re-bonding under ambient conditions.

  5. Medical device manufacturing where biocompatibility support documentation and low outgassing are critical.

Specifications Of PUCONS 2058 Epoxy Adhesive

Chemical TypeBisphenol-A based epoxy resin with amine hardener
Product FormTwo-component liquid system (Part A: resin, Part B: hardener)
AppearancePart A: pale amber transparent liquid; Part B: light yellow transparent liquid
Mix Ratio by Weight100 : 35 (A : B)
Working Life at 25 °C60–75 minutes after mixing
Full Cure Time7 days at 25 °C or 24 hours at 80 °C
Primary ApplicationsStructural bonding, potting, and encapsulation in demanding industrial environments
Key FeaturesRoom-temperature cure, halogen-free, UL 94 V-0, low shrinkage


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