Ultra-low modulus silicone gel formulation enabling exceptional conformal protection without mechanical stress on delicate components.
High dielectric strength (>20 kV/mm) and stable insulation performance across wide temperature and humidity ranges.
Blue colorant for clear visual identification and precise application control during dispensing and inspection.
Two-part, room-temperature curing system with extended pot life and low exotherm for safe encapsulation of heat-sensitive electronics.
Excellent adhesion to common substrates including FR-4, aluminum, copper, and molded plastics without primers.
Protection of high-voltage power electronics in EV inverters and onboard chargers.
Conformal encapsulation of LED drivers and lighting modules exposed to thermal cycling.
Dielectric isolation and mechanical damping for sensors in industrial automation and IoT edge devices.
Underfill and stress-relief gelling for power semiconductor modules (e.g., IGBTs, SiC MOSFETs).
| Chemical Type | Two-part addition-cure silicone gel |
| Product Form | Kit comprising Part A (base) and Part B (catalyst), supplied separately |
| Appearance | Part A: Blue translucent viscous liquid; Part B: Colorless to pale yellow liquid |
| Primary Applications | Dielectric encapsulation, stress relief, and environmental protection of electronic assemblies |
| Key Features | Low modulus, high dielectric strength, blue color indicator, RTV cure |
| Benefits | Minimizes CTE mismatch stress, enables reworkability before cure, supports automated dispensing |
| Curing System | Pt-catalyzed hydrosilylation (addition cure) |
| Shelf Life (unopened, 25°C) | 12 months from date of manufacture |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China