Non-corrosive, silicone-based formulation designed for long-term reliability in sensitive electronic assemblies.
Ultra-low modulus provides stress relief and accommodates thermal expansion mismatch between components and substrates.
Excellent dielectric strength (>20 kV/mm) and stable electrical insulation performance across wide temperature and humidity ranges.
Thixotropic behavior enables easy dispensing and prevents slumping or migration after application.
UL 94 V-0 rated for flame resistance, supporting compliance with stringent safety standards.
Thermal interface material (TIM) for power electronics, including IGBT modules and EV inverters.
Dielectric encapsulation and potting of high-voltage sensors, battery management systems (BMS), and charging interfaces.
Gap-filling insulation in LED lighting drivers and solid-state relays where vibration resistance is critical.
Protection of fine-pitch connectors and flex circuit assemblies in automotive ADAS and infotainment systems.
| Chemical Type | Dimethyl silicone polymer with fumed silica reinforcement |
| Product Form | Two-component kit (Part A: base gel; Part B: platinum-cure catalyst) |
| Appearance | Opaque off-white viscous gel (Part A); colorless to pale yellow liquid (Part B) |
| Mixed Viscosity (25°C) | ~150,000–200,000 cP (Brookfield, spindle #7, 2 rpm) |
| Cure System | Pt-catalyzed hydrosilylation (room temperature cure with optional heat acceleration) |
| Operating Temperature Range | −50°C to +200°C (continuous) |
| Density (Mixed, 25°C) | ~1.12 g/cm³ |
| Shelf Life (Unopened, 25°C) | 12 months for Part A; 6 months for Part B |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China