Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Dow DOWSIL 3-6265 Thixotropic Adhesive

Dow DOWSIL 3-6265 Thixotropic Adhesive is a high-performance silicone-based adhesive from Dow’s DOWSIL portfolio. It offers excellent thixotropy for sag resistance, strong adhesion to diverse substrates, and reliable performance across wide temperature ranges. Ideal for bonding, sealing, and potting in demanding industrial applications.
  • dow dowsil 3 6265 thixotropic adhesive_65cc2732
  • dow dowsil 3 6265 thixotropic adhesive_65cc2732

Features Of Dow DOWSIL 3-6265 Thixotropic Adhesive

  1. Thixotropic silicone adhesive that maintains shape after dispensing without sagging or slumping on vertical or overhead surfaces.

  2. Excellent adhesion to a wide range of substrates including metals, glass, ceramics, and many plastics without primers.

  3. High-performance cure at room temperature with low modulus elasticity for stress relief in bonded assemblies.

  4. Good resistance to thermal cycling, humidity, and UV exposure—suitable for long-term outdoor use.

  5. Non-corrosive, acetoxy-free formulation compatible with sensitive electronic components and optical materials.

Typical Applications Of Dow DOWSIL 3-6265 Thixotropic Adhesive

  1. Structural bonding of architectural glazing systems, including insulating glass units (IGUs) and curtain wall components.

  2. Mounting and sealing of solar photovoltaic modules and junction boxes in renewable energy installations.

  3. Adhesive bonding of LED lighting housings, lenses, and heat sinks in commercial and industrial fixtures.

  4. General-purpose assembly of automotive interior trim, sensors, and display modules requiring vibration-dampening adhesion.

  5. Repair and rework of electronic enclosures, control panels, and industrial instrumentation where gap-filling and flexibility are critical.

Specifications Of Dow DOWSIL 3-6265 Thixotropic Adhesive

Chemical TypeAcetoxy-cured silicone elastomer
Product FormPaste (thixotropic)
AppearanceOpaque white to off-white paste
Primary ApplicationsStructural bonding, sealing, and mounting in construction, electronics, and renewable energy
Key FeaturesRoom-temperature curing, non-sag, primerless adhesion, low modulus
BenefitsReduced assembly time, improved reliability under thermal cycling, no corrosion risk to metals or electronics
Cure MechanismMoisture-cured (surface-to-depth)
Shelf Life (unopened)12 months at ≤25°C in original sealed container


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