One-component, moisture-curing silicone adhesive offering excellent adhesion to low-surface-energy substrates including plastics and coated metals.
High flexibility and elongation at break (>200%) to accommodate thermal expansion and mechanical vibration in demanding assemblies.
Wide service temperature range from –55 °C to +200 °C with long-term stability under continuous thermal exposure.
Good resistance to UV radiation, ozone, and weathering—suitable for outdoor and automotive exterior applications.
Low modulus formulation minimizes stress transfer to delicate components such as sensors and optical lenses.
Automotive lighting assemblies—including headlamp and taillamp bonding and sealing.
Electronic module encapsulation and potting for sensors, control units, and LED drivers.
Industrial appliance gasketing and bonding of housings exposed to temperature cycling.
Aerospace interior trim attachment where flame-smoke-toxicity (FST) compliance is required.
Medical device housing assembly requiring biocompatibility support and sterilization resistance.
| Chemical Type | Acetoxy-cure silicone polymer |
| Product Form | Paste-like, thixotropic, non-sag adhesive |
| Appearance | Opaque white or off-white |
| Primary Applications | Bonding, sealing, and gasketing of plastics, metals, glass, and elastomers |
| Key Features | Room-temperature cure, no primer required on most substrates |
| Benefits | Reduces assembly time and eliminates secondary processing steps |
| Cure Mechanism | Moisture-cured via acetic acid release |
| Shelf Life (unopened) | 12 months at ≤25 °C in original sealed container |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China