Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

DOWSIL EA-6052 Low-Temp Cure Silicone Adhesive

DOWSIL EA-6052 is a low-temperature curing silicone adhesive from Dow’s high-performance EA series. It bonds reliably at temperatures as low as –40°C, offering excellent flexibility, thermal stability, and resistance to moisture and chemicals. Ideal for automotive, electronics, and aerospace applications requiring robust adhesion under extreme cold conditions.
  • dowsil ea 6052 low temp cure silicone adhesive_703272ec
  • dowsil ea 6052 low temp cure silicone adhesive_703272ec

Features Of DOWSIL EA-6052 Low-Temp Cure Silicone Adhesive

  1. Cures rapidly at low temperatures (as low as 60 °C), enabling energy-efficient processing and compatibility with heat-sensitive substrates.

  2. Offers excellent adhesion to diverse substrates including plastics, metals, glass, and painted surfaces without primers.

  3. Delivers high flexibility and elongation (>150%) after cure, maintaining performance across thermal cycling and mechanical stress.

  4. Provides outstanding resistance to moisture, UV radiation, and thermal aging—retaining integrity from –55 °C to +200 °C.

  5. Formulated as a one-component, moisture-curing silicone adhesive—no mixing required and extended shelf life under sealed conditions.

Typical Applications Of DOWSIL EA-6052 Low-Temp Cure Silicone Adhesive

  1. Automotive lighting assemblies—including LED headlamp bonding and lens sealing.

  2. Consumer electronics encapsulation and gasketing for wearables and portable devices.

  3. Medical device assembly requiring biocompatibility-compliant adhesives and low-temperature processing.

  4. Industrial sensors and IoT modules where thermal stability and substrate versatility are critical.

  5. Appliance control panels and display bonding in white goods manufacturing.

Specifications Of DOWSIL EA-6052 Low-Temp Cure Silicone Adhesive

Chemical TypeOne-component, acetoxy-cure silicone adhesive
Product FormPaste, thixotropic, ready-to-use
AppearanceOff-white to light beige, homogeneous paste
Primary ApplicationsBonding, sealing, and gasketing in low-temperature assembly processes
Key FeaturesLow-temp cure, primerless adhesion, high flexibility, moisture/UV resistant
BenefitsReduced energy consumption, improved line efficiency, enhanced reliability on sensitive components
Cure MechanismMoisture-cured (ambient humidity)
Storage ConditionsStore in original unopened container at 5–25 °C; protect from moisture


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