Cures rapidly at low temperatures (as low as 60 °C), enabling energy-efficient processing and compatibility with heat-sensitive substrates.
Offers excellent adhesion to diverse substrates including plastics, metals, glass, and painted surfaces without primers.
Delivers high flexibility and elongation (>150%) after cure, maintaining performance across thermal cycling and mechanical stress.
Provides outstanding resistance to moisture, UV radiation, and thermal aging—retaining integrity from –55 °C to +200 °C.
Formulated as a one-component, moisture-curing silicone adhesive—no mixing required and extended shelf life under sealed conditions.
Automotive lighting assemblies—including LED headlamp bonding and lens sealing.
Consumer electronics encapsulation and gasketing for wearables and portable devices.
Medical device assembly requiring biocompatibility-compliant adhesives and low-temperature processing.
Industrial sensors and IoT modules where thermal stability and substrate versatility are critical.
Appliance control panels and display bonding in white goods manufacturing.
| Chemical Type | One-component, acetoxy-cure silicone adhesive |
| Product Form | Paste, thixotropic, ready-to-use |
| Appearance | Off-white to light beige, homogeneous paste |
| Primary Applications | Bonding, sealing, and gasketing in low-temperature assembly processes |
| Key Features | Low-temp cure, primerless adhesion, high flexibility, moisture/UV resistant |
| Benefits | Reduced energy consumption, improved line efficiency, enhanced reliability on sensitive components |
| Cure Mechanism | Moisture-cured (ambient humidity) |
| Storage Conditions | Store in original unopened container at 5–25 °C; protect from moisture |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China