High thermal conductivity (1.5 W/m·K) for efficient heat dissipation in demanding electronic assemblies.
Low modulus and excellent compressibility, enabling reliable interfacial contact under minimal clamping pressure.
UL 94 V-0 rated flame retardancy for enhanced safety in power electronics and lighting applications.
Non-sag, paste-like consistency ensures precise dispensing and stable gap-filling without slumping or migration.
Wide operating temperature range from –50 °C to +200 °C, maintaining performance across thermal cycling conditions.
Thermal interface material (TIM) between IGBT modules and heat sinks in electric vehicle inverters.
Heat transfer medium for LED drivers and high-power LED packages in outdoor lighting systems.
Gap-filling compound for battery management systems (BMS) and power conversion units in renewable energy inverters.
Thermal coupling layer in 5G base station power amplifiers and RF power modules.
Die-attach and heat-spreading solution for high-brightness automotive lighting assemblies.
| Chemical Type | Room Temperature Vulcanizing (RTV) silicone elastomer |
| Product Form | Paste (non-sag, thixotropic) |
| Appearance | Gray, uniform paste |
| Primary Applications | Thermal interface material (TIM), gap filler, heat sink bonding |
| Key Features | Electrically insulating, flame retardant (UL 94 V-0), low outgassing |
| Thermal Conductivity | 1.5 W/m·K (ASTM D5470) |
| Operating Temperature Range | –50 °C to +200 °C |
| Cure Mechanism | Moisture-cure (acetoxy type) |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China