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Two-component, addition-cure silicone adhesive system offering excellent thermal stability and long-term reliability.
Low modulus formulation provides superior stress relief for bonded assemblies subjected to thermal cycling or mechanical vibration.
Room-temperature mixing and dispensing with controlled pot life (≈4 hours at 25°C), enabling flexible production scheduling.
UL 94 V-0 rated after full cure, supporting compliance in safety-critical electronic and electrical applications.
Non-corrosive, platinum-catalyzed chemistry compatible with sensitive substrates including copper, aluminum, and polyimide films.
Thermal interface bonding of heat sinks to power modules in automotive EV inverters and onboard chargers.
Structural adhesion of LED packages and ceramic substrates in high-brightness lighting systems.
Die attach and underfill encapsulation for semiconductor sensors operating in harsh under-hood environments.
Attachment of temperature-sensitive components in industrial control units requiring minimal thermal stress during operation.
| Chemical Type | Platinum-catalyzed addition-cure silicone |
| Product Form | Two-component liquid kit (Part A + Part B) |
| Appearance | Part A: Transparent to light amber liquid; Part B: Clear to pale yellow liquid |
| Mix Ratio (by weight) | 1:1 |
| Cure Condition | 24 hours at 25°C, or accelerated cure at 60–80°C for 2–4 hours |
| Shore A Hardness (cured) | 25–30 |
| Volume Resistivity (ASTM D257) | >1 × 10¹⁵ Ω·cm |
| UL Recognition | UL 94 V-0 (per UL 746C, 1.6 mm thickness) |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
