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Ultra-fast cure at low temperatures (as low as 60°C in under 10 minutes).
Excellent adhesion to challenging substrates including plastics, metals, and coated surfaces.
Low outgassing and high thermal stability for demanding electronics and aerospace environments.
Non-corrosive formulation compatible with sensitive electronic components.
Good resistance to thermal cycling, humidity, and automotive fluids.
Automotive sensor bonding and module assembly.
LED lighting encapsulation and heat sink attachment.
Aerospace avionics component mounting.
Consumer electronics display and camera module bonding.
Industrial IoT device assembly requiring rapid throughput.
| Chemical Type | Two-component silicone epoxy hybrid |
| Product Form | Paste (Part A and Part B) |
| Appearance | Off-white to light gray paste |
| Primary Applications | Structural bonding and potting in electronics and transportation |
| Key Features | Fast low-temperature cure, high bond strength, low stress |
| Benefits | Enables energy-efficient manufacturing, reduces thermal damage risk, improves line speed |
| Cure Schedule (Typical) | 60°C for 10 minutes or 80°C for 5 minutes |
| Shelf Life (Unopened) | 12 months at ≤25°C |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
