Ultra-low modulus silicone gel formulation for exceptional stress relief and thermal cycling performance.
Fast, one-step UV curing at room temperature—no heat or moisture required.
Excellent adhesion to diverse substrates including plastics, glass, ceramics, and coated metals.
Outstanding long-term stability with minimal outgassing and low ionic impurities.
Optically clear, non-yellowing formulation suitable for sensitive optical and LED applications.
Encapsulation and protection of surface-mount LEDs (SMD LEDs) and micro-LED arrays.
Underfill and stress-relief bonding for miniaturized sensors and MEMS devices.
Optical coupling and lens overmolding in automotive lighting and head-up display (HUD) modules.
Conformal coating and edge sealing for flexible printed circuit boards (FPCBs) in wearables.
Die attach and cavity filling for high-reliability optoelectronic assemblies.
| Chemical Type | UV-curable aliphatic silicone gel |
| Product Form | Thixotropic viscous liquid (paste-like) |
| Appearance | Clear, colorless to pale yellow gel |
| Primary Applications | Optoelectronic encapsulation, LED protection, MEMS stress relief |
| Key Features | Low modulus (~0.1–0.3 MPa), rapid UV cure (< 30 s @ 365 nm), no byproducts |
| Benefits | Superior thermal shock resistance, minimal CTE mismatch, halogen-free |
| Shelf Life | 6 months unopened at 5–25 °C, protected from UV light |
| Compliance | RoHS 2015/863/EU, REACH SVHC free, UL 94 V-0 (cured) |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China