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High-performance, one-component, moisture-curing silicone adhesive with excellent adhesion to low-surface-energy substrates.
Offers outstanding flexibility and elongation (>200%) after cure, accommodating thermal and mechanical stress.
Provides superior resistance to UV exposure, ozone, and extreme temperatures (–55 °C to +180 °C continuous).
Low modulus formulation minimizes stress transfer and reduces risk of substrate cracking or delamination.
Meets UL 94 V-0 flammability rating for enhanced safety in electronic and transportation applications.
LED lighting assemblies — bonding lenses, housings, and heat sinks.
Automotive electronics — sealing and mounting sensors, control units, and display modules.
Industrial control panels — adhering nameplates, membranes, and interface components.
Consumer electronics — structural bonding of enclosures and internal components requiring vibration damping.
Solar photovoltaic modules — edge sealing and component attachment under outdoor exposure conditions.
| Chemical Type | Acetoxy-cure silicone elastomer |
| Product Form | Paste, thixotropic, medium viscosity |
| Appearance | Off-white to light tan, homogeneous paste |
| Primary Applications | Structural bonding, sealing, and gasketing in electronics and transportation |
| Key Features | One-component, room-temperature curing, no mixing required |
| Shore A Hardness (7 days, 23 °C/50% RH) | 25–30 |
| Tensile Strength (ASTM D412) | 1.8–2.2 MPa |
| Elongation at Break (ASTM D412) | ≥220% |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
