Two-part, platinum-cured silicone system offering excellent flexibility and long-term reliability after cure.
Low modulus and high elongation (>100%) enable stress relief in bonded assemblies subject to thermal cycling or mechanical vibration.
Excellent adhesion to a broad range of substrates including glass, metals, ceramics, and many plastics without primers.
UL 94 V-0 rated for flame resistance, supporting safety-critical electronic encapsulation and potting applications.
Low viscosity before mixing (Part A ~15,000 cP; Part B ~50 cP) enables easy dispensing and thorough wetting of complex geometries.
Encapsulation and potting of power electronics, including IGBT modules and LED drivers.
Bonding and sealing of sensors, automotive control units, and under-hood components exposed to wide temperature swings.
Die-attach and conformal coating for high-voltage and high-reliability aerospace and defense electronics.
Flexible interconnect bonding in wearable medical devices requiring biocompatibility-compliant materials.
| Chemical Type | Platinum-cured two-part addition-cure silicone |
| Product Form | Two-component liquid (Part A: viscous base; Part B: low-viscosity catalyst) |
| Appearance | Part A: translucent amber liquid; Part B: colorless to pale yellow liquid |
| Mix Ratio (by weight) | 10:1 (A:B) |
| Cure Schedule (typical) | 2 hours at 100°C or 24 hours at 25°C |
| Hardness (Shore A, cured) | 30–35 |
| Elongation at Break (cured) | ≥110% |
| Primary Applications | Electronic encapsulation, bonding, sealing, and potting |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China