Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Dow SYLGARD 527 A&B Silicone Adhesive

Dow SYLGARD 527 A&B is a two-part platinum-cured silicone adhesive offering exceptional flexibility, thermal stability (−55°C to 200°C), and electrical insulation. It cures at room temperature or accelerated with heat, delivering low modulus, high elongation (>150%), and excellent adhesion to diverse substrates—ideal for encapsulation, bonding, and sealing in electronics, aerospace, and medical devices.
  • dow sylgard 527 a b silicone adhesive_980bddce
  • dow sylgard 527 a b silicone adhesive_980bddce

Features Of Dow SYLGARD 527 A&B Silicone Adhesive

  1. Two-part, platinum-cured silicone system offering excellent flexibility and long-term reliability after cure.

  2. Low modulus and high elongation (>100%) enable stress relief in bonded assemblies subject to thermal cycling or mechanical vibration.

  3. Excellent adhesion to a broad range of substrates including glass, metals, ceramics, and many plastics without primers.

  4. UL 94 V-0 rated for flame resistance, supporting safety-critical electronic encapsulation and potting applications.

  5. Low viscosity before mixing (Part A ~15,000 cP; Part B ~50 cP) enables easy dispensing and thorough wetting of complex geometries.

Typical Applications Of Dow SYLGARD 527 A&B Silicone Adhesive

  1. Encapsulation and potting of power electronics, including IGBT modules and LED drivers.

  2. Bonding and sealing of sensors, automotive control units, and under-hood components exposed to wide temperature swings.

  3. Die-attach and conformal coating for high-voltage and high-reliability aerospace and defense electronics.

  4. Flexible interconnect bonding in wearable medical devices requiring biocompatibility-compliant materials.

Specifications Of Dow SYLGARD 527 A&B Silicone Adhesive

Chemical TypePlatinum-cured two-part addition-cure silicone
Product FormTwo-component liquid (Part A: viscous base; Part B: low-viscosity catalyst)
AppearancePart A: translucent amber liquid; Part B: colorless to pale yellow liquid
Mix Ratio (by weight)10:1 (A:B)
Cure Schedule (typical)2 hours at 100°C or 24 hours at 25°C
Hardness (Shore A, cured)30–35
Elongation at Break (cured)≥110%
Primary ApplicationsElectronic encapsulation, bonding, sealing, and potting


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