Name: Dow DOWSIL EA-2016 Silicone Adhesive
Brand: Guangzhou Eric Wei Chemical Co., Ltd.

Features Of Dow DOWSIL EA-2016 Silicone Adhesive

High-performance, one-component, moisture-curing silicone adhesive with excellent adhesion to diverse substrates including glass, aluminum, stainless steel, and painted surfaces.
Offers outstanding resistance to thermal cycling, UV exposure, and weathering—maintaining flexibility and bond integrity from −55 °C to 200 °C.
Low modulus formulation provides superior stress relief in bonded assemblies subject to vibration, expansion, or contraction.
Non-corrosive cure chemistry—acetoxy byproduct-free—making it safe for sensitive electronic and optical components.
Easy application via manual or pneumatic dispensing; achieves handling strength in approximately 30–60 minutes at 23 °C/50% RH.

Typical Applications Of Dow DOWSIL EA-2016 Silicone Adhesive

Structural bonding and sealing of architectural glazing systems, including curtain walls and insulating glass units (IGUs).
Electronic encapsulation and potting of LED lighting modules, power supplies, and automotive control units.
Assembly of solar photovoltaic modules—bonding junction boxes, frames, and backsheets while resisting long-term outdoor exposure.
Sealing and bonding in HVAC equipment, such as heat exchangers and fan housings requiring thermal and environmental durability.
Medical device assembly where biocompatibility-adjacent materials and low outgassing are critical (ISO 10993 pre-screened).

Chemical Type	One-part, condensation-cure, acetoxy-free silicone adhesive
Product Form	Paste-like, thixotropic, ready-to-use cartridge material (310 mL and 600 mL cartridges)
Appearance	Opaque white to off-white paste
Primary Applications	Structural bonding, sealing, and gasketing in building & construction, electronics, renewable energy, and industrial equipment
Key Features	Low modulus, non-corrosive cure, high elongation (>200%), excellent adhesion without primer on many substrates
Benefits	Reduces assembly stress, eliminates post-cure steps, improves long-term reliability under thermal and mechanical cycling
Cure Mechanism	Moisture-cured at ambient temperature; full cure depth ~3–4 mm in 7 days at 23 °C/50% RH
Shelf Life	12 months unopened in original sealed packaging at ≤25 °C

Get in Touch with ERICW

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E-mail: wangxingqiang@ericwchem.com
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15921782326
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China