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Two-component, addition-cure silicone adhesive offering excellent thermal stability and long-term reliability.
Low modulus formulation provides superior stress relief for bonded assemblies subjected to thermal cycling or mechanical vibration.
Self-leveling rheology enables uniform bond line thickness and minimizes void formation during dispensing.
UL 94 V-0 rated for flame resistance, supporting compliance in demanding electronic and transportation applications.
Adheres well to common substrates including aluminum, stainless steel, glass, and engineered plastics without primer.
Die attach and component bonding in power electronics modules (e.g., IGBTs, SiC inverters).
Sealing and bonding of LED lighting housings and heat sinks in outdoor and high-humidity environments.
Structural bonding of sensors and control units in automotive under-hood systems.
Attachment of battery module components requiring thermal management and electrical insulation.
Encapsulation and potting of sensitive electronic assemblies exposed to wide temperature ranges.
| Chemical Type | Platinum-catalyzed addition-cure silicone |
| Product Form | Two-component liquid (Part A + Part B) |
| Appearance | Opaque white (Part A), translucent beige (Part B) |
| Primary Applications | Structural bonding, thermal interface bonding, and encapsulation in electronics and automotive |
| Key Features | Low modulus, self-leveling, UL 94 V-0 rated, thermal cycling resistant |
| Benefits | Reduces thermal stress, improves long-term reliability, eliminates need for primers on many substrates |
| Cure System | Heat-curable (typical: 150°C for 30 minutes) |
| Shelf Life | 12 months at 25°C (unopened, original packaging) |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
