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Two-part, platinum-cured silicone adhesive system offering rapid room-temperature cure with excellent depth of cure.
High adhesion to challenging substrates including plastics, metals, glass, and silicone elastomers without primer.
Outstanding thermal stability across –60 °C to +200 °C continuous service range.
Low modulus and high elongation provide superior stress relief and vibration damping in dynamic assemblies.
UL 94 V-0 rated for flame resistance; meets RoHS and REACH compliance requirements.
LED lighting module encapsulation and lens bonding in outdoor and high-heat environments.
Automotive sensor assembly and electronic control unit (ECU) potting where thermal cycling resistance is critical.
Medical device housing bonding requiring biocompatibility support and sterilization compatibility.
Industrial power electronics bonding, including IGBT modules and power converters.
Consumer electronics structural bonding for wearables and portable devices exposed to temperature extremes.
| Chemical Type | Platinum-cured addition-cure silicone |
| Product Form | Two-component kit (Part A: base, Part B: catalyst) |
| Appearance | Part A: translucent viscous liquid; Part B: translucent low-viscosity liquid |
| Mix Ratio (by weight) | 10:1 (A:B) |
| Cure Schedule | 24 hours at 25 °C or 30 minutes at 100 °C |
| Shore A Hardness (7 days, 25 °C) | 35–40 |
| Elongation at Break | ≥250% |
| Primary Applications | Structural bonding, encapsulation, and potting of electronics and precision assemblies |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
