Two-part, addition-cure silicone adhesive offering excellent adhesion to diverse substrates including metals, plastics, and glass.
Low modulus formulation provides high flexibility and stress relief for bonded assemblies subjected to thermal cycling or vibration.
UL 94 V-0 rated for flame resistance, supporting compliance in demanding electronic and transportation applications.
Excellent long-term stability at elevated temperatures up to 200 °C continuous service, with short-term exposure capability up to 250 °C.
No by-products generated during cure—ensuring clean, void-free bonds ideal for sensitive optical and electronic components.
Bonding and sealing of LED modules and light engines in automotive lighting and general illumination systems.
Encapsulation and structural bonding of power electronics, including IGBT modules and EV battery control units.
Assembly of sensors and actuators requiring reliable performance under wide temperature and humidity variations.
Attachment of heat sinks and thermal interface components in high-power semiconductor packaging.
Sealing and bonding in aerospace avionics housings where low outgassing and radiation resistance are critical.
| Chemical Type | Addition-cure silicone elastomer |
| Product Form | Two-component (Part A: base; Part B: catalyst), supplied separately |
| Appearance (Mixed) | Opaque, off-white paste |
| Primary Applications | Structural bonding, encapsulation, and sealing in electronics and automotive systems |
| Key Features | Low modulus, flame retardant (UL 94 V-0), no volatile by-products |
| Shore A Hardness (7 days @ 23 °C) | 35–45 |
| Tensile Strength (ASTM D412) | 3.0–4.5 MPa |
| Cure Schedule (Typical) | 2 hrs @ 100 °C or 24 hrs @ 23 °C |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China