English
Español
tiếng việt
русский
High thermal conductivity for efficient heat dissipation in demanding electronic assemblies.
Low modulus silicone formulation enabling stress relief and long-term reliability under thermal cycling.
Room-temperature cure with optional heat-assisted acceleration for flexible manufacturing integration.
Excellent adhesion to common substrates including aluminum, copper, ceramics, and plated plastics.
UL 94 V-0 rated for flame retardancy, supporting safety-compliant designs.
Attachment of power semiconductor devices (e.g., IGBTs, MOSFETs) to heat sinks in EV inverters and industrial drives.
Bonding LED modules and drivers in high-brightness lighting systems requiring stable thermal management.
Thermal interface bonding in 5G base station power amplifiers and RF front-end modules.
Die attachment and heat sink bonding in aerospace and defense avionics where vibration resistance is critical.
Assembly of renewable energy power converters, including solar inverters and wind turbine controllers.
| Chemical Type | Heat-curable, addition-cure silicone elastomer |
| Product Form | Paste (two-component, Part A + Part B) |
| Appearance | Gray, homogeneous paste |
| Primary Applications | Structural thermal bonding and die attach |
| Key Features | Thermally conductive, electrically insulating, low modulus |
| Benefits | Reduces interfacial thermal resistance; accommodates CTE mismatch; enables simplified assembly |
| Cure Schedule (Typical) | 24 h at 25°C or 1 h at 100°C |
| Storage Stability | 12 months at ≤25°C (unopened) |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
