High-performance, two-part addition-cure silicone adhesive offering excellent thermal stability and long-term reliability.
Low modulus formulation provides superior stress relief for bonded assemblies subjected to thermal cycling or mechanical vibration.
Excellent adhesion to a wide range of substrates including metals, glass, ceramics, and engineered plastics without primers.
UL 94 V-0 rated for flame resistance, supporting safety-critical electronic and electrical applications.
Low outgassing and high purity—compliant with NASA ASTM E595, suitable for aerospace and vacuum environments.
Encapsulation and bonding of power electronics modules (e.g., IGBTs, inverters, and EV battery control units).
Structural assembly of LED lighting systems requiring thermal management and optical clarity retention.
Bonding and sealing in aerospace avionics housings exposed to extreme temperature gradients.
Die attach and component fixation in high-reliability medical devices and diagnostic equipment.
| Chemical Type | Platinum-catalyzed addition-cure silicone |
| Product Form | Two-component liquid (Part A: base; Part B: catalyst) |
| Appearance | Translucent, low-viscosity liquid (Part A); translucent, low-viscosity liquid (Part B) |
| Mix Ratio by Weight | 10:1 (A:B) |
| Cure Schedule (Typical) | 2 hours at 100°C or 24 hours at 25°C |
| Shore A Hardness (Cured) | 30–35 |
| Volume Resistivity (25°C) | >1 × 10¹⁵ Ω·cm |
| UL Recognition | UL 94 V-0, UL 746E (RTI Electrical 180°C) |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China