Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Dow DOWSIL SE 9140 RTV Silicone Adhesive

Dow DOWSIL SE 9140 RTV Silicone Adhesive is a one-component, moisture-curing silicone sealant offering excellent adhesion to metals, plastics, and glass. It provides superior thermal stability, flexibility, and resistance to weathering, UV, and chemicals. Ideal for automotive, electronics, and industrial bonding/sealing applications requiring reliable, long-term performance.
  • dow dowsil se 9140 rtv silicone adhesive_ea8edab3
  • dow dowsil se 9140 rtv silicone adhesive_ea8edab3

Features Of Dow DOWSIL SE 9140 RTV Silicone Adhesive

  1. High-performance, one-component, moisture-curing RTV silicone adhesive with excellent adhesion to diverse substrates including metals, glass, and plastics.

  2. Offers outstanding resistance to thermal cycling, UV exposure, and weathering over extended service life.

  3. Low modulus formulation provides superior flexibility and stress relief for bonded assemblies subjected to vibration or thermal expansion.

  4. Non-corrosive cure chemistry—releases methanol, making it suitable for sensitive electronic and optical components.

  5. Good electrical insulation properties and stable dielectric performance across wide temperature and humidity ranges.

Typical Applications Of Dow DOWSIL SE 9140 RTV Silicone Adhesive

  1. Bonding and sealing of LED lighting housings and heat sinks in outdoor luminaires.

  2. Structural assembly of automotive sensors, control units, and under-hood electronics.

  3. Encapsulation and edge bonding of photovoltaic modules and solar panel frames.

  4. Mounting and sealing of industrial control panels, display interfaces, and HMI enclosures.

  5. Adhesive joining of medical device housings requiring biocompatibility-supporting material compatibility and low outgassing.

Specifications Of Dow DOWSIL SE 9140 RTV Silicone Adhesive

Chemical TypeOne-part, condensation-cure, methyl-terminated polydimethylsiloxane (PDMS)
Product FormPaste-like, thixotropic, non-sag gel
AppearanceOpaque white to off-white
Primary ApplicationsBonding, sealing, and gasketing in electronics, automotive, and renewable energy systems
Key FeaturesLow modulus, high flexibility, non-corrosive cure, excellent adhesion without primer
BenefitsReduces thermal and mechanical stress, extends product lifetime, simplifies assembly process
Cure MechanismMoisture-cured at room temperature; full cure achieved in 7 days at 23°C/50% RH
Shelf Life12 months unopened in original sealed container at ≤25°C


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