Two-component, platinum-catalyzed silicone gel system offering excellent thixotropy for sag resistance and precise dispensing control.
Low modulus and high elongation provide superior stress relief for delicate electronic components and interconnects.
Room-temperature cure with optional heat acceleration—enabling flexibility in manufacturing throughput and process integration.
UL 94 V-0 rated (per ASTM D3801), supporting compliance in safety-critical electrical insulation applications.
Excellent dielectric properties and long-term stability across wide temperature and humidity ranges (-55 °C to 200 °C).
Encapsulation and potting of sensitive power electronics, including IGBT modules and inverters.
Underfill and edge bonding for LED arrays and high-brightness lighting assemblies.
Thermal interface and mechanical cushioning for battery management systems (BMS) and EV power modules.
Protection of MEMS sensors, automotive radar units, and ADAS components against vibration and thermal cycling.
| Chemical Type | Platinum-catalyzed addition-cure silicone gel |
| Product Form | Two-part liquid system (Part A: base; Part B: catalyst) |
| Appearance | Part A: translucent viscous liquid; Part B: translucent low-viscosity liquid |
| Mix Ratio (by weight) | 10:1 (A:B) |
| Cure Profile | RT cure (7 days) or accelerated at 60 °C (2–4 hours) |
| Hardness (Shore 00) | 10–15 (after full cure) |
| Density (g/cm³) | Approx. 1.08–1.12 (mixed) |
| Primary Applications | Electronics encapsulation, stress-relieving potting, thermal and mechanical protection |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China