Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Dow DOWSIL EG-3000 Thixotropic Gel Parts A&B

Dow DOWSIL EG-3000 Thixotropic Gel Parts A&B is a two-component silicone-based thixotropic gel system engineered for precision dispensing and void-free encapsulation. Featuring excellent slump resistance, thermal stability, and low ionic content, it cures to a soft, resilient elastomer ideal for sensitive electronics protection and aerospace applications.
  • dow dowsil eg 3000 thixotropic gel parts a b_c81ad90e
  • dow dowsil eg 3000 thixotropic gel parts a b_c81ad90e

Features Of Dow DOWSIL EG-3000 Thixotropic Gel Parts A&B

  1. Two-component, platinum-catalyzed silicone gel system offering excellent thixotropy for sag resistance and precise dispensing control.

  2. Low modulus and high elongation provide superior stress relief for delicate electronic components and interconnects.

  3. Room-temperature cure with optional heat acceleration—enabling flexibility in manufacturing throughput and process integration.

  4. UL 94 V-0 rated (per ASTM D3801), supporting compliance in safety-critical electrical insulation applications.

  5. Excellent dielectric properties and long-term stability across wide temperature and humidity ranges (-55 °C to 200 °C).

Typical Applications Of Dow DOWSIL EG-3000 Thixotropic Gel Parts A&B

  1. Encapsulation and potting of sensitive power electronics, including IGBT modules and inverters.

  2. Underfill and edge bonding for LED arrays and high-brightness lighting assemblies.

  3. Thermal interface and mechanical cushioning for battery management systems (BMS) and EV power modules.

  4. Protection of MEMS sensors, automotive radar units, and ADAS components against vibration and thermal cycling.

Specifications Of Dow DOWSIL EG-3000 Thixotropic Gel Parts A&B

Chemical TypePlatinum-catalyzed addition-cure silicone gel
Product FormTwo-part liquid system (Part A: base; Part B: catalyst)
AppearancePart A: translucent viscous liquid; Part B: translucent low-viscosity liquid
Mix Ratio (by weight)10:1 (A:B)
Cure ProfileRT cure (7 days) or accelerated at 60 °C (2–4 hours)
Hardness (Shore 00)10–15 (after full cure)
Density (g/cm³)Approx. 1.08–1.12 (mixed)
Primary ApplicationsElectronics encapsulation, stress-relieving potting, thermal and mechanical protection


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